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Smart Intelligent Computing and Applications pp 375–384Cite as

A Redundant Adder Architecture in Ternary Quantum-Dot Cellular Automata

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Part of the book series: Smart Innovation, Systems and Technologies ((SIST,volume 159))

Abstract

Now researchers are moving toward emerging technologies to replace the conventional CMOS technology. Quantum-dot cellular automata (QCA) are one of them for high-performance computing circuits. Ternary QCA is one of the finest research areas in this domain for replacement of binary logic. In this paper, we proposed a new redundant adder architecture using Ternary QCA technology. Our proposed architecture has 233 numbers of cells with an area of 0.35 µm2. All the proposed ternary logic layouts are implemented in TQCA designer tool.

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Author information

Authors and Affiliations

  1. Department of Electronics and Telecommunication, Veer Surendra Sai University of Technology, Burla, 768018, India

    Bandan Kumar Bhoi, Ipsita Dash & Ankita Patra

  2. Bharat Institute of Engineering and Technology, Hyderabad, India

    Neeraj Kumar Misra

Authors
  1. Bandan Kumar Bhoi
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  2. Neeraj Kumar Misra
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  3. Ipsita Dash
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  4. Ankita Patra
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Corresponding author

Correspondence to Bandan Kumar Bhoi .

Editor information

Editors and Affiliations

  1. School of Computer Engineering, KIIT Deemed to be University, Bhubaneswar, Odisha, India

    Suresh Chandra Satapathy

  2. Department of Electronics and Communication Engineering, Shri Ramswaroop Memorial Group of Professional Colleges, Lucknow, Uttar Pradesh, India

    Vikrant Bhateja

  3. School of Computer Applications, KIIT University, Bhubaneswar, Odisha, India

    J. R. Mohanty

  4. School of Computer and Information Science, University of Hyderabad, Hyderabad, Telangana, India

    Siba K. Udgata

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Cite this paper

Bhoi, B.K., Misra, N.K., Dash, I., Patra, A. (2020). A Redundant Adder Architecture in Ternary Quantum-Dot Cellular Automata. In: Satapathy, S., Bhateja, V., Mohanty, J., Udgata, S. (eds) Smart Intelligent Computing and Applications . Smart Innovation, Systems and Technologies, vol 159. Springer, Singapore. https://doi.org/10.1007/978-981-13-9282-5_35

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