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Effect of Chip Treatment on Chip-Based Billet Densification in Solid-State Recycling of New Aluminium Scrap

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Advances in Material Sciences and Engineering

Part of the book series: Lecture Notes in Mechanical Engineering ((LNME))

Abstract

In solid state recycling of new aluminium scrap, processes prior to hot extrusion play an important role in order to obtain free-defect microvoid extrudates. The microvoid is formed due to air entrapment that came from porous chip-based billet. In this work, chip-based billet made from annealed and non-annealed chip was investigated to determine the effect of annealing on density, void pattern and hardness. AA6061-T651 chips were prepared as annealed and non-annealed and then compacted in die. The billets density and appearance were measured and visually inspected. Density measurement found that billet made from annealed chip has the highest relative density of 96.9%. Visual inspection and microstructure examination disclose that voids are present in the billet for both types of chip in which non-annealed chip is more obvious. The voids has distributed in homogeneously along the axial and vertical due to pressure gradient. The pressure gradient also affects the hardness distribution. The effect of strain hardening is more obvious at the peripheral compared to the centre. The average hardness of annealed chip is 49.5 HV0.1 while non-annealed chip recorded 89.5 HV0.1. In general, annealing treatment before compaction had softened the chip, reduced the hardness and strength, permitted large plastic deformation and improved billet density .

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Acknowledgements

The authors would like to express their deepest appreciation to the Ministry of Higher Education Malaysia (MOHE), for funding this project through the Research Grant Schemes TIER 1 H085.

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Authors and Affiliations

  1. Sustainable Manufacturing and Recycling Technology, Advanced Material Manufacturing Center (SMART-AMMC), Universiti Tun Hussein Onn Malaysia, Parit Raja, Malaysia

    A. Wagiman, Mohd Sukri Mustapa, S. Shamsudin, Mohd Amri Lajis, R. Asmawi & M. A. Harimon

  2. Department of Engineering Design and Manufacture, University of Malaya, Kuala Lumpur, Malaysia

    Farazila Yusof

  3. Mechanical Engineering Department, University of Wasit, Kut, Iraq

    Mohammed H. Rady

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  1. A. Wagiman
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  2. Mohd Sukri Mustapa
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  3. S. Shamsudin
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  4. Mohd Amri Lajis
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  6. M. A. Harimon
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  7. Farazila Yusof
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  8. Mohammed H. Rady
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Corresponding author

Correspondence to Mohd Sukri Mustapa .

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Editors and Affiliations

  1. Department of Mechanical Engineering, Universiti Teknologi PETRONAS, Seri Iskandar, Perak, Malaysia

    Mokhtar Awang

  2. Department of Mechanical Engineering, Universiti Teknologi PETRONAS, Seri Iskandar, Perak, Malaysia

    Seyed Sattar Emamian

  3. Department of Mechanical Engineering, University of Malaya, Kuala Lumpur, Malaysia

    Farazila Yusof

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Wagiman, A. et al. (2020). Effect of Chip Treatment on Chip-Based Billet Densification in Solid-State Recycling of New Aluminium Scrap. In: Awang, M., Emamian, S., Yusof, F. (eds) Advances in Material Sciences and Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-13-8297-0_35

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  • DOI: https://doi.org/10.1007/978-981-13-8297-0_35

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-8296-3

  • Online ISBN: 978-981-13-8297-0

  • eBook Packages: EngineeringEngineering (R0)

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