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Fabrication Technologies

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Abstract

This chapter deals with the fabrication processes and techniques employed in silicon wafer. The basics of bonding techniques are also explained and its role in RF devices is highlighted. Basically, there are three major processes involved during fabrication of any MEMS devices, namely, bulk micromachining, surface micromachining, and wafer bonding.

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Authors and Affiliations

  1. Department of Space, Government of India, Semi-Conductor Laboratory, Chandigarh, India

    Ayan Karmakar

  2. U. R. Rao Satellite Centre, Bangalore, Karnataka, India

    Kamaljeet Singh

Authors
  1. Ayan Karmakar
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  2. Kamaljeet Singh
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Corresponding author

Correspondence to Ayan Karmakar .

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© 2019 Springer Nature Singapore Pte Ltd.

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Karmakar, A., Singh, K. (2019). Fabrication Technologies. In: Si-RF Technology. Springer, Singapore. https://doi.org/10.1007/978-981-13-8051-8_2

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  • DOI: https://doi.org/10.1007/978-981-13-8051-8_2

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-8050-1

  • Online ISBN: 978-981-13-8051-8

  • eBook Packages: EngineeringEngineering (R0)

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