Plasma Processes for Functionalization and Control of Materials Surface

Abstract

Low-temperature and low-damage processing of materials is required for formation of advanced devices with inorganic/organic hybrid structure, including flexible electronics, photovoltaic cells, and biomaterials. For formation of high-quality organic/inorganic hybrid devices, low-temperature, and low-damage formation of high-quality inorganic functional layers (semiconductor and/or transparent conductive oxide) on organic materials is required and ultra-fine control of interface structure is significant for avoiding considerable degradation of the organic materials. In this chapter, low-temperature and low-damage processes with plasma process technology have been described on the basis of low-damage plasma production with low-inductance antenna (LIA) modules for sustaining inductively coupled radio-frequency discharges, which can provide high-density and low-damage plasmas.