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Novel Structured Metallic and Inorganic Materials pp 191–201Cite as

Soldering Process

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Abstract

Soldering is the major micro-joining process for assembling printed circuit boards of electronic products and is an important method of joining two metals without melting of base metals. In light of the remarkable progress in recent years in electronic products, the micro-joining process represented in soldering to incorporate devices and components into such products has become an essential technology. It can be truly said that soldering and electronics assembly technology have progressed with electronic products. In this chapter, the status of development and research of soldering and cutting edge joining process substituting for soldering are explained. In particular, in the first half, we will discuss development in Japan concerning lead-free solder, and the second half will look into research on materials with the potential to replace high-lead-containing solder for high-temperature applications.

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Author information

Authors and Affiliations

  1. Joining and Welding Research Institute, Osaka University, Ibaraki, Japan

    Hiroshi Nishikawa

Authors
  1. Hiroshi Nishikawa
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Correspondence to Hiroshi Nishikawa .

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Editors and Affiliations

  1. Osaka University, Osaka, Japan

    Yuichi Setsuhara

  2. Tokyo Institute of Technology, Yokohama, Japan

    Toshio Kamiya

  3. Tohoku University, Sendai, Japan

    Shin-ichi Yamaura

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Nishikawa, H. (2019). Soldering Process. In: Setsuhara, Y., Kamiya, T., Yamaura, Si. (eds) Novel Structured Metallic and Inorganic Materials. Springer, Singapore. https://doi.org/10.1007/978-981-13-7611-5_12

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