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Proceedings of the Third International Conference on Microelectronics, Computing and Communication Systems pp 245–260Cite as

Operational Transconductance Amplifier Structured Highly Linear Analog Multiplier

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Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 556))

Abstract

Analog multiplier is a key element in modern communication systems. This paper presents the capability of cross-coupled operational transconductance amplifier (OTA) as an analog multiplier with performance analysis and design consideration. The proposed OTA structure is built and tested as a multiplier in Cadence Analog Design Environment (ADE) using standard 0.18 μm CMOS process. The simulation result shows that the proposed OTA structured multiplier has better linearity with comparable power consumption and noise performance.

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Acknowledgements

The support of the Management and the Director Dr. M. B. Khambete of MKSSS’s Cummins College of Engineering for Women Karve Nagar, Pune is gratefully acknowledged.

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Authors and Affiliations

  1. E&TC Department, Cummins College of Engineering for Women, Pune, Maharashtra, India

    Amitkumar S. Khade

  2. E&TC Department, College of Engineering Pune, Pune, Maharashtra, India

    Vibha Vyas

Authors
  1. Amitkumar S. Khade
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  2. Vibha Vyas
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Corresponding author

Correspondence to Amitkumar S. Khade .

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Editors and Affiliations

  1. Department of Electronics and Communication Engineering, Birla Institute of Technology, Mesra, Ranchi, Jharkhand, India

    Vijay Nath

  2. Department of Computer Science and Engineering, University of Kalyani, Kalyani, West Bengal, India

    Jyotsna Kumar Mandal

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Khade, A.S., Vyas, V. (2019). Operational Transconductance Amplifier Structured Highly Linear Analog Multiplier. In: Nath, V., Mandal, J. (eds) Proceedings of the Third International Conference on Microelectronics, Computing and Communication Systems. Lecture Notes in Electrical Engineering, vol 556. Springer, Singapore. https://doi.org/10.1007/978-981-13-7091-5_23

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  • DOI: https://doi.org/10.1007/978-981-13-7091-5_23

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-7090-8

  • Online ISBN: 978-981-13-7091-5

  • eBook Packages: EngineeringEngineering (R0)

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