Abstract
The effect of Cu content on the microstructure and properties of Al–Mg–Si alloy was studied by optical microscopy scanning electron microscopy, transmission electron microscopy, and tensile test. The state of the heat treatment is directly aged at 165 °C after a solid solution. The results show that with the increase of Cu content, the tensile strength of Al–Mg–Si alloy first increases and then decreases, and the conductivity has no obvious change. When the content of Cu is 0.3%, the tensile strength of Al–Mg–Si alloy is significantly increased to 336 MPa and the electrical conductivity is 49.6% IACS.
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Li, HX., Guo, S., Du, P., Liu, SP. (2019). Effect of Cu Content on Microstructure and Properties of Al–Mg–Si Alloy. In: Han, Y. (eds) Physics and Engineering of Metallic Materials. CMC 2018. Springer Proceedings in Physics, vol 217. Springer, Singapore. https://doi.org/10.1007/978-981-13-5944-6_15
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DOI: https://doi.org/10.1007/978-981-13-5944-6_15
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