Abstract
The three-dimensional Network-on-Chip (3D NoC) has been proposed to resolve the complex on-chip communication issues in multicore systems by using die stacking technology in recent years. It is more difficult to guarantee performance in 3D NoC system than 2D because of stacking dies and the unequal thermal conductance of different logic layers. To ensure the system performance and availability, we proposes an Inter-Layer-Distance based Routing (ILDR) algorithm, which distributes the traffic according to the inter-layer-distance from source node to destination node. We simultaneously consider the buffer status and node temperature of neighbors on path to determine the horizontal route of the next hop. The simulation results show that the proposed ILDR algorithm can apparently reduce network latency and improve network throughput in different experimental traffic patterns. Although the energy consumption is increased, the Energy delay product (EDP) is reduced, so ILDR is a power-efficient solution for 3D NoC.
Supported by the Research Fund of State Key Laboratory of High Performance Computing, National University of Defense Technology, P.R. China. Under Grant No. 201612-01, and HGJ National Key Project with grant 2017ZX01028103.
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Zou, T., Zhang, C., Peng, X., Peng, Y. (2019). An Inter-Layer-Distance Based Routing Algorithm for 3D Network-on-Chip. In: Xu, W., Xiao, L., Li, J., Zhu, Z. (eds) Computer Engineering and Technology. NCCET 2018. Communications in Computer and Information Science, vol 994. Springer, Singapore. https://doi.org/10.1007/978-981-13-5919-4_3
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DOI: https://doi.org/10.1007/978-981-13-5919-4_3
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