Skip to main content
SpringerLink
Log in

Vacuum-Based Picking-up and Placing-on

  • Chapter
  • First Online:
Modeling and Application of Flexible Electronics Packaging

Abstract

This chapter mainly focuses on the modeling and optimization of the chip picking-up and placing-on, including the processes of the chip picking-up through the vacuum adsorption, roll-to-roll (R2R) processing, and thermal-compressing-based ultra-thin chip-on-flex (UTCOF) packaging, and is organized as follows. Analytical models of the chip-adhesive-substrate structure subjected to the vacuum adsorption were first proposed to investigate the mechanism of the chip picking-up based on hypotheses of constant and variable lengths of the substrate. Effects of the vacuum adsorption pressure (VAP), the type of the picking-up head, and the picking-up displacement were analyzed to improve the capability of the chip detachment along the adhesive layer. A process optimization was carried out to ensure the complete chip detachment. After picking-up, the chip placing-on determines the reliability of the packaged system. The chip placing-on was then theoretically investigated by integration with the R2R processing. Effects of material properties, geometric dimensions, and process temperatures were explored. An optimization approach was presented to reduce the interfacial residual stress. Last, in consideration of the adhesive thickness approximating to the thickness of the ultra-thin chip and flexible substrate, the warpage of the UTCOF assembly was predicted by using a layerwise-model combining subdivided mathematical plies.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 84.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Hardcover Book
USD 109.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. Peng B, Huang Y, Yin Z, Xiong Y (2011) Analysis of interfacial peeling in IC chip pick-up process. J Appl Phys 110(7):073508

    Article  Google Scholar 

  2. Peng B, Huang Y, Yin Z, Xiong Y (2011) On the analysis of dynamic effect in the die pick-up process. In: 12th international conference on electronic packaging technology and high density packaging, 8–11 Aug 2011. IEEE, pp 1–4

    Google Scholar 

  3. Liu Z, Huang Y, Chen J, Yin Z (2014) Tunable peeling technique and mechanism of thin chip from compliant adhesive tapes. IEEE Trans Compon Packag Manuf Technol 4(4):560–568

    Article  Google Scholar 

  4. Feil M, Adler C, Hemmetzberger D, Konig M, Bock K (2004) The challenge of ultra thin chip assembly. In: 54th Electronic Components and Technology Conference (IEEE Cat. No. 04CH37546), 4–4 June 2004. IEEE, pp 35–40

    Google Scholar 

  5. Peng B, Huang Y, Yin Z, Xiong Y (2012) Competing fracture modeling of thin chip pick-up process. IEEE Trans Compon Packag Manuf Technol 2(7):1217–1225

    Article  Google Scholar 

  6. Liu Z, Wan X, Huang Y, Chen J, Yin Z (2018) Theoretical and experimental studies of competing fracture for flexible chip-adhesive-substrate composite structure. IEEE Trans Compon Packag Manuf Technol 8(1):57–64

    Article  Google Scholar 

  7. Liu Z, Huang Y, Xiao L, Tang P, Yin Z (2015) Nonlinear characteristics in fracture strength test of ultrathin silicon die. Semicond Sci Technol 30(4):045005

    Article  Google Scholar 

  8. Lin YJ, Hwang SJ (2005) Static analysis of the die picking process. IEEE Trans Electron Packag Manuf 28(2):142–149

    Article  Google Scholar 

  9. Cheng TH, Du CC, Tseng CH (2006) Study in IC chip failure during pick-up process by using experimental and finite element methods. J Mater Process Technol 172(172):407–416

    Article  Google Scholar 

  10. Xu Z, Liu Z, Liu H, Yin Z, Huang Y, Chen J (2015) Analytical evaluation of interfacial crack propagation in vacuum-based picking-up process. IEEE Trans Compon Packag Manuf Technol 5(11):1700–1708

    Article  Google Scholar 

  11. Hassan M-U, Angelopoulos EA, Rempp H, Endler S, Burghartz JN (2010) Packaging challenges associated with warpage of ultra-thin chips. In: 3rd electronics system integration technology conference ESTC, 13–16 Sept 2010. IEEE, pp 1–5

    Google Scholar 

  12. Chen J, Xu Z, Huang Y, Duan Y, Yin Z (2016) Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex (UTCOF) assembly. Sci China Technol Sci 59(11):1646–1655

    Article  Google Scholar 

  13. Lu S-T, Chen W-H (2010) Reliability and flexibility of ultra-thin chip-on-flex (UTCOF) interconnects with anisotropic conductive adhesive (ACA) joints. IEEE Trans Adv Packag 33(3):702–712

    Article  Google Scholar 

  14. Yang SY, Kwon W-S, Lee S-B (2012) Chip warpage model for reliability prediction of delamination failures. Microelectron Reliab 52(4):718–724

    Article  Google Scholar 

  15. Liu Y (2010) Trends of power semiconductor wafer level packaging. Microelectron Reliab 50(4):514–521

    Article  Google Scholar 

  16. Tu K (2011) Reliability challenges in 3D IC packaging technology. Microelectron Reliab 51(3):517–523

    Article  Google Scholar 

  17. Liu Z, Valvo PS, Huang Y, Yin Z (2013) Cohesive failure analysis of an array of IC chips bonded to a stretched substrate. Int J Solids Struct 50(22–23):3528–3538

    Google Scholar 

  18. Liu Z, Huang Y, Yin Z, Bennati S, Valvo PS (2014) A general solution for the two-dimensional stress analysis of balanced and unbalanced adhesively bonded joints. Int J Adhes Adhes 54:112–123

    Article  Google Scholar 

  19. He M, Evans A, Hutchinson J (1997) Convergent debonding of films and fibers. Acta Mater 45(8):3481–3489

    Article  Google Scholar 

  20. Xu Z, Liu Z, Huang Y, Chen J, Liu H, Yin Z (2015) Vacuum-based picking-up of thin chip from adhesive tape. J Adhes Sci Technol 29(13):1315–1329

    Article  Google Scholar 

  21. Medding J, Stalder R, Niederhauser M, Stoessel P (2004) Thin die bonding techniques. In: IEEE/CPMT/SEMI 29th international electronics manufacturing technology symposium (IEEE Cat. No. 04CH37585), 14–16 July 2004. IEEE, pp 68–73

    Google Scholar 

  22. Liu Z, Huang YA, Liu H, Chen J, Yin Z (2014) Reliable peeling of ultrathin die with multineedle ejector. IEEE Trans Compon Packag Manuf Technol 4(9):1545–1554

    Article  Google Scholar 

  23. Cheung YM, Chong ACM, Huang B (2006) Determination of the interfacial fracture toughness of laminated silicon die on adhesive dicing tape from stud pull measurement. In: International conference on electronic materials and packaging, 11–14 Dec 2006. IEEE, pp 1–10

    Google Scholar 

  24. Chen J, Liu H, Huang Y, Yin Z (2016) High-rate roll-to-roll stack and lamination of multilayer structured membrane electrode assembly. J Manuf Process 23:175–182

    Article  Google Scholar 

  25. Huang Y, Yin Z, Xiong Y (2010) Thermomechanical analysis of thin films on temperature-dependent elastomeric substrates in flexible heterogeneous electronics. Thin Solid Films 518(6):1698–1702

    Article  Google Scholar 

  26. Huang Y, Chen J, Yin Z, Xiong Y (2011) Roll-to-roll processing of flexible heterogeneous electronics with low interfacial residual stress. IEEE Trans Compon Packag Manuf Technol 1(9):1368–1377

    Article  Google Scholar 

  27. Gleskova H, Cheng IC, Wagner S, Sturm JC, Suo Z (2006) Mechanics of thin-film transistors and solar cells on flexible substrates. Sol Energy 80(6):687–693

    Article  Google Scholar 

  28. Huang Y, Yin Z, Xiong Y (2010) Thermomechanical analysis of film-on-substrate system with temperature-dependent properties. J Appl Mech Trans ASME 77(4):041016

    Article  Google Scholar 

  29. Wang KP, Huang YY, Chandra A, Hu KX (2000) Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies. IEEE Trans Compon Packag Technol 23(2):309–316

    Article  Google Scholar 

  30. Jiang ZQ, Huang Y, Chandra A (1997) Thermal stresses in layered electronic assemblies. J Electr Packag Trans ASME 119(2):127–132

    Article  Google Scholar 

  31. Lu S-T, Chen W-H (2010) Experimental/numerical analysis of thermally induced warpage of ultrathin chip-on-flex (UTCOF) interconnects. IEEE Trans Compon Packag Technol 33(4):819–829

    Article  Google Scholar 

  32. Yao Q, Qu J (1999) Three-dimensional versus two-dimensional finite element modeling of flip-chip packages. J Electron Packag 121(3):196–201

    Article  Google Scholar 

  33. Zhao J-H, Dai X, Ho PS (1998) Analysis and modeling verification for thermal-mechanical deformation in flip-chip packages. In: 48th electronic components and technology conference (Cat. No. 98CH36206), 25–28 May 1998. IEEE, pp 336–344

    Google Scholar 

  34. Nosier A, Kapania RK, Reddy J (1993) Free vibration analysis of laminated plates using a layerwise theory. AIAA J 31(12):2335–2346

    Article  Google Scholar 

  35. Yousefsani SA, Tahani M (2013) Accurate determination of stress distributions in adhesively bonded homogeneous and heterogeneous double-lap joints. Eur J Mech A/Solids 39:197–208

    Article  MathSciNet  Google Scholar 

  36. Yousefsani SA, Tahani M (2014) An analytical investigation on thermomechanical stress analysis of adhesively bonded joints undergoing heat conduction. Arch Appl Mech 84(1):67–79

    Article  Google Scholar 

  37. Yousefsani SA, Tahani M (2013) Analytical solutions for adhesively bonded composite single-lap joints under mechanical loadings using full layerwise theory. Int J Adhes Adhes 43:32–41

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology (HUST), Wuhan, People’s Republic of China

    YongAn Huang

  2. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology (HUST), Wuhan, People’s Republic of China

    Zhouping Yin

  3. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology (HUST), Wuhan, People’s Republic of China

    Xiaodong Wan

Authors
  1. YongAn Huang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Zhouping Yin
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Xiaodong Wan
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

Copyright information

© 2019 Science Press and Springer Nature Singapore Pte Ltd.

About this chapter

Check for updates. Verify currency and authenticity via CrossMark

Cite this chapter

Huang, Y., Yin, Z., Wan, X. (2019). Vacuum-Based Picking-up and Placing-on. In: Modeling and Application of Flexible Electronics Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-13-3627-0_9

Download citation

  • DOI: https://doi.org/10.1007/978-981-13-3627-0_9

  • Published:

  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-3626-3

  • Online ISBN: 978-981-13-3627-0

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics

Search

Navigation