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Laser Lift-off

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Modeling and Application of Flexible Electronics Packaging

Abstract

With the rapid development of flexible electronic devices towards the large-area and ultra-thin direction, it is increasingly demanded to investigate how to peel flexible devices from rigidly prepared carrier effectively. Laser lift-off (LLO) is an emerging technology in the field of microelectronics due to the high speed, simplicity, and cost-efficiency, etc. In this chapter, the LLO mechanism of the ultra-thin polyimide (PI) film (thinner than 5 μm) from the rigid glass carrier was revealed preliminarily in combination with the gas products generated by the laser irradiation. The impact effect of insufficient gas products was found difficult to peel the PI film off the glass carrier completely. Excess gases and accompanied high impact effect should lead to wrinkles or cracking of the ultra-thin PI film. Changes in the residual interface adhesion strength were also interpreted relating to the evolution of interface microstructure. Process parameters were optimized considering the laser fluence and irradiation time. It was found that the strategy of low-energy laser pulse combined with multiple irradiations can achieve a reliable LLO of the ultra-thin PI film. This study provides an attractive route to peel flexible devices from the glass carrier.

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Authors and Affiliations

  1. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology (HUST), Wuhan, People’s Republic of China

    YongAn Huang, Zhouping Yin & Xiaodong Wan

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  1. YongAn Huang
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  2. Zhouping Yin
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  3. Xiaodong Wan
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Correspondence to YongAn Huang .

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Huang, Y., Yin, Z., Wan, X. (2019). Laser Lift-off. In: Modeling and Application of Flexible Electronics Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-13-3627-0_8

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  • DOI: https://doi.org/10.1007/978-981-13-3627-0_8

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-3626-3

  • Online ISBN: 978-981-13-3627-0

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