Abstract
The flip-chip packaging process becomes challenging with the development of ultra-thin chip. The multi-needle peeling-off process is a potential way to solve the conflict between the chip peeling and the chip cracking for the ultra-thin chip. In this chapter, an analytical model of the multi-needle peeling-off process was first presented. Effects of the propagation of the interfacial crack and layout of ejector needles on the bending normal stress at the top surface of the chip layer and the ERR of interfacial peeling were investigated. The bending normal stress at the top surface of the chip layer can be found reduced effectively when more needles are employed. However, the ejector needles added rarely worked to increase the ERR of interfacial peeling. The essence of multi-needle adoption was discussed combined with the single-needle peeling-off process. A competing fracture model based on the chip-adhesive-substrate structure was further developed. A criterion of the chip peelability was proposed for the needle peeling-off process. Combining the chip peeling and chip cracking indexes, an improvement on the ultra-thin chip peeling-off through the multi-needle adoption was discussed. A process window was preliminarily determined by using a homemade experimental platform. A modified multi-needle peeling-off process with independently controlled needles was finally proposed.
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Huang, Y., Yin, Z., Wan, X. (2019). Multi-needle Peeling. In: Modeling and Application of Flexible Electronics Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-13-3627-0_6
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DOI: https://doi.org/10.1007/978-981-13-3627-0_6
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