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Tension-Assisted Peeling

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Modeling and Application of Flexible Electronics Packaging

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Abstract

This chapter describes theoretical predictions of the peeling behavior of adhesively bonded joints under substrate tension condition. The substrate tension can enhance the ERR of interfacial peeling between the chip and substrate, which may improve the chip peelability. The proposed approach can be extended to predict the delamination behavior of bonded structures such as composite laminates and flexible electronics. Analytical solutions of balanced and unbalanced adhesively bonded joints were first determined combining mixed force and displacement boundary conditions. A mechanical model predicting the debonding behavior of a periodic array of chips adhesively bonded to a stretched substrate was also proposed via the multi-segment analysis. Effects of key factors including the distance between adjacent chips, chip length, and material properties of the adhesive and substrate layers were considered. The approaches were proved useful in analyzing various adhesively bonded structures including the stiffened plate, single-strap, and single-lap joints.

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Authors and Affiliations

  1. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology (HUST), Wuhan, People’s Republic of China

    YongAn Huang, Zhouping Yin & Xiaodong Wan

Authors
  1. YongAn Huang
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  2. Zhouping Yin
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  3. Xiaodong Wan
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Correspondence to YongAn Huang .

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Huang, Y., Yin, Z., Wan, X. (2019). Tension-Assisted Peeling. In: Modeling and Application of Flexible Electronics Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-13-3627-0_4

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  • DOI: https://doi.org/10.1007/978-981-13-3627-0_4

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-3626-3

  • Online ISBN: 978-981-13-3627-0

  • eBook Packages: EngineeringEngineering (R0)

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