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Interfacial Modeling of Flexible Multilayer Structures

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Modeling and Application of Flexible Electronics Packaging

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Abstract

The multilayer structures are widely used in composite structures and flexible electronics. Two kinds of mechanical models, chip-on-substrate structure and chip-adhesive-substrate structure, were discussed here to study the interfacial peeling behavior. First, an analytical model of the chip-on-substrate structure subjected to a transverse concentrated load resulting from an ejector needle was proposed. The finite element model combining the virtual crack closure technique (VCCT) was adopted to calculate the energy release rate (ERR) of interfacial peeling. Second, an analytical model of the chip-adhesive-substrate structure was built for the typical balanced and unbalanced adhesively bonded joints. A unit cell of the layered structure was modeled as an assembly of two elastic Timoshenko beams connected by an elastic interface, representing the chip, substrate, and adhesive layers, respectively. The analytical expressions for internal forces, displacements, and adhesive stresses were derived separately. The proposed model can be conveniently extended to predict the mechanical behavior of bonded structures such as composite laminates and film-on-substrate structure of flexible electronics.

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Authors and Affiliations

  1. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology (HUST), Wuhan, People’s Republic of China

    YongAn Huang, Zhouping Yin & Xiaodong Wan

Authors
  1. YongAn Huang
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  2. Zhouping Yin
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  3. Xiaodong Wan
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Correspondence to YongAn Huang .

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Huang, Y., Yin, Z., Wan, X. (2019). Interfacial Modeling of Flexible Multilayer Structures. In: Modeling and Application of Flexible Electronics Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-13-3627-0_2

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  • DOI: https://doi.org/10.1007/978-981-13-3627-0_2

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-3626-3

  • Online ISBN: 978-981-13-3627-0

  • eBook Packages: EngineeringEngineering (R0)

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