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Advanced Electronic Packaging

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Modeling and Application of Flexible Electronics Packaging

Abstract

Issues of chip/device transferring are becoming increasingly serious with the decreasing of chip/device thickness and size. The application of ultra-thin (<50 μm) silicon-based chips is challenging the current electronic packaging processes. Special attentions are being paid to the structure delamination, chip warping, and chip cracking with respect to the ultra-thin chip transferring. This chapter summarizes the current developments relating to the transferring process, including thin/ultra-thin chip peeling-off, picking-up, and placing-on. Approaches to address the deformation and failure behavior of the adhesively bonded multilayer structure commonly used in the analysis of the above procedures are discussed. Typical and innovative processes of needle ejecting, conformal peeling, laser-induced peeling, vacuum-based picking-up and placing-on are all included.

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  1. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology (HUST), Wuhan, People’s Republic of China

    YongAn Huang, Zhouping Yin & Xiaodong Wan

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Huang, Y., Yin, Z., Wan, X. (2019). Advanced Electronic Packaging. In: Modeling and Application of Flexible Electronics Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-13-3627-0_1

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