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Engineering Fair: Going Beyond the Classroom

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Abstract

Engineering Fair is an event where all engineering students at Taylor’s University School of Engineering present their final design for their project publicly. At the fair, these projects are evaluated not only from the technical perspective, but also for the effectiveness how key facts about the project are delivered within a limited time. Judges are from both academic and the industry. The score each team received during the engineering fair will contribute to 10% of their design module score. In this chapter, the rationale for having engineering fair as part of the design module and its assessment criteria are discussed.

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Notes

  1. 1.

    Artefact assessment is an internal assessment a few weeks before Engineering Fair where every team will need to present their design to internal assessors who will judge and critique their work.

References

  1. Renvoisé, P., & Morin, C. (2002). Neuromarketing: Understanding the “buy button” in your customer’s brain. Nashville, Tennessee: Thomas Nelson.

    Google Scholar 

  2. Sinek, S. (2009). Start with why. New York: Penguin.

    Google Scholar 

  3. Heath, C., & Heath, D. (2007). Made to stick. New York: Random House.

    Google Scholar 

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Correspondence to Kun Yong Ng .

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© 2019 Springer Nature Singapore Pte Ltd.

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Ng, K.Y., Chung, E.C.Y. (2019). Engineering Fair: Going Beyond the Classroom. In: Amouzad Mahdiraji, G., Chung, E., Namasivayam, S., Hosseini Fouladi, M. (eds) Engineering Grand Challenges in Scholar Programs. Springer, Singapore. https://doi.org/10.1007/978-981-13-3579-2_5

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  • DOI: https://doi.org/10.1007/978-981-13-3579-2_5

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-3578-5

  • Online ISBN: 978-981-13-3579-2

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