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New Polymeric Materials Based on Element-Blocks pp 121–137Cite as

Nanocomposite Materials Properties of Aminophenylsilsesquioxanes

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Abstract

A series of aminophenylsilsesquioxanes were synthesized and cross-linked with a set of epoxy resins to form 3-D epoxy resins with completely defined interfaces. The objectives of this work were to make materials with very low coefficients of thermal expansions (CTEs) such that these materials could be used for flip-chip underfill in the manufacture of chips on printed circuit boards. Related polyimides were made as oxygen barrier materials. We were able to make epoxy resin hybrid composites with CTEs of ≈30 ppm/°C. Likewise with polyimides we were able to make composite resins with oxygen transmission rates of 3–5 ± 0.5 cc·20 μm/m2·day·atm in films that were only 0.5 mm thick.

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Acknowledgments

The authors would like to thank Delphi Inc., Kuraray Ltd., Matsushita Electric, and AFRL Wright Patterson Air Force Base through subcontract from Mayaterials on SBIR Contract Number F33615 03M 5018 for support of this work.

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Authors and Affiliations

  1. Departments of Materials Science and Engineering, Chemistry and The Macromolecular Science and Engineering Center, University of Michigan, Ann Arbor, MI, USA

    R. M. Laine, K. Takahasi, R. Tamaki, J. Choi, S. G. Kim, C. Brick, M. Z. Asuncion, E. Chetioui & S. Sulaiman

  2. Delphi Research Laboratories, Shelby Township, MI, USA

    R. Basheer

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  1. R. M. Laine
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  2. K. Takahasi
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  3. R. Tamaki
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  4. J. Choi
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  5. S. G. Kim
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  6. C. Brick
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  7. M. Z. Asuncion
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  8. E. Chetioui
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  9. S. Sulaiman
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  10. R. Basheer
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Correspondence to R. M. Laine .

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Editors and Affiliations

  1. Department of Polymer Chemistry, Kyoto University, Kyoto, Japan

    Yoshiki Chujo

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Laine, R.M. et al. (2019). Nanocomposite Materials Properties of Aminophenylsilsesquioxanes. In: Chujo, Y. (eds) New Polymeric Materials Based on Element-Blocks. Springer, Singapore. https://doi.org/10.1007/978-981-13-2889-3_7

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