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A Brief Study and Analysis to Investigate the Effect of Various Dielectric Materials on Substrate-Integrated Waveguide

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Advances in Signal Processing and Communication

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 526))

Abstract

Substrate-Integrated Waveguide (SIW) technology is an emerging and promising candidate for the development of circuits and components in upper microwave and millimeter wave region. This paper aims at emphasizing various dielectric substrates for the analysis of SIW to investigate their effect on the characteristic curve and electric field distribution. Certain factors that have been considered for evaluation are electric field, transmission gain, and return loss. High-Frequency Structure Simulator (HFSS) has been used to carry out the designs.

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Authors and Affiliations

  1. Department of ECE, BIT Mesra, Patna Campus, Patna, India

    Fatima Haider & Megha Dade

Authors
  1. Fatima Haider
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  2. Megha Dade
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Corresponding author

Correspondence to Fatima Haider .

Editor information

Editors and Affiliations

  1. University of Nevada, Reno, Reno, NV, USA

    Banmali S. Rawat

  2. Atal Bihari Vajpayee Indian Institute of Information Technology and Management, Gwalior, Gwalior, Madhya Pradesh, India

    Aditya Trivedi

  3. Indian Institute of Technology Roorkee, Roorkee, Uttarakhand, India

    Sanjeev Manhas

  4. Jaypee Institute of Information Technology, Noida, Uttar Pradesh, India

    Vikram Karwal

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© 2019 Springer Nature Singapore Pte Ltd.

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Haider, F., Dade, M. (2019). A Brief Study and Analysis to Investigate the Effect of Various Dielectric Materials on Substrate-Integrated Waveguide. In: Rawat, B., Trivedi, A., Manhas, S., Karwal, V. (eds) Advances in Signal Processing and Communication . Lecture Notes in Electrical Engineering, vol 526. Springer, Singapore. https://doi.org/10.1007/978-981-13-2553-3_32

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  • DOI: https://doi.org/10.1007/978-981-13-2553-3_32

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-2552-6

  • Online ISBN: 978-981-13-2553-3

  • eBook Packages: EngineeringEngineering (R0)

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