Abstract
Stencil cleaning is a necessary operation step in solder paste printing process. Frequent cleaning operation usually leads to an excessive waste of cleaning agency and increased standby time. This paper proposes an approach for controlling the cleaning operation through variable stencil cleaning threshold sequences. A downtime ratio model is established to obtain the sequences, and a case study is given to show how to acquire the threshold sequences and makes decisions of stencil cleaning.
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Acknowledgement
The authors gratefully acknowledge the support of Mengxun corporation in providing the experiment environment used for this work. This research is funded by national intelligent manufacturing project.
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Niu, S. et al. (2018). Decision-Making of Stencil Cleaning for Solder Paste Printing Machine Based on Variable Threshold Sequence. In: Wang, S., Price, M., Lim, M., Jin, Y., Luo, Y., Chen, R. (eds) Recent Advances in Intelligent Manufacturing . ICSEE IMIOT 2018 2018. Communications in Computer and Information Science, vol 923. Springer, Singapore. https://doi.org/10.1007/978-981-13-2396-6_31
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DOI: https://doi.org/10.1007/978-981-13-2396-6_31
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