Numerical Investigation of Cylindrical Heat Pipe Performance

  • Aishwarya Chaudhari
  • Mangesh BorkarEmail author
  • Arvind Deshpande
  • Mandar Tendolkar
  • Vivek K. Singh
Conference paper
Part of the Advances in Intelligent Systems and Computing book series (AISC, volume 757)


The thermophysical properties of wick microstructures and heat interactions across the wick play a central role in heat pipe performance. It is therefore essential to analyse the wick microstructures. The performance of a cylindrical heat pipe with a screen mesh wick structure is analysed numerically using two-dimensional, axisymmetric, and transient model. A fully implicit, structured collocated finite-volume scheme is used in conjunction with the SIMPLE algorithm to solve Navier–Stokes equations for both, liquid and vapour phases. Present model assumes the wick to be saturated with the liquid and a porous medium formulation is employed for the wick. The evaporation and condensation rates at the diphasic interface are determined using kinetic theory. The model is tested for time step independency and a parametric study is performed by varying the permeability of wick and heat input. The results presented are in good agreement with the data from the previous literature.


Cylindrical heat pipe Permeability Evaporation Condensation 


\( C_{p} \)

Specific heat


Thermal conductivity


Wick permeability

\( \dot{m}^{{\prime \prime }} \)

Interface mass flux


Molecular weight


Number of nodes





\( \vec{u} \)

Velocity vector


Heat input

\( T_{\infty } \)

Coolant temperature

\( h_{\infty } \)

Heat transfer coefficient

\( \hat{P} \)

Hydrodynamic pressure

\( L_{E} \)

Length of evaporator

\( L_{C} \)

Length of condenser

\( L_{A} \)

Length of adiabatic


\( \sigma \)

Accommodation coefficient

\( \emptyset \)

Porosity of the wick















Radial direction


Axial direction


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Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  • Aishwarya Chaudhari
    • 1
  • Mangesh Borkar
    • 1
    Email author
  • Arvind Deshpande
    • 1
  • Mandar Tendolkar
    • 1
  • Vivek K. Singh
    • 2
  1. 1.Department of Mechanical EngineeringVeermata Jijabai Technological InstituteMumbaiIndia
  2. 2.Thermal DivisionSpace Application Centre, ISROAhmedabadIndia

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