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Printed Circuit Board Modelling for Thermal Analysis of Electronics Packages

  • Jayesh Mahitkar
  • Mayank Chauhan
  • Hardik Gediya
  • Vivek K. SinghEmail author
Conference paper
Part of the Advances in Intelligent Systems and Computing book series (AISC, volume 757)

Abstract

Thermal design of electronics subsystems containing printed circuit boards (PCBs) for space applications is quite a challenging and time-consuming job due to lack of convective environment and no possibility of repair in case of failure once subsystem is launched in the mission. Thermal designer tries to reduce modelling and computational effort by modelling multilayer PCBs in equivalent lesser number of layers. This paper deals with case study of a typical electronics subsystems having one multilayered PCB thermal modelling. Two cases are considered for thermal analysis. In one case, all layers of PCB are modelled as they are and in second case multilayered PCB (10 layers) is modelled in two equivalent layers.

Keywords

PCB Thermal modelling Electronics package Thermal design 

List of Symbols

\( k_{p,e} \)

Effective parallel thermal conductivity

\( k_{n,e} \)

Effective normal thermal conductivity

References

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Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  • Jayesh Mahitkar
    • 1
  • Mayank Chauhan
    • 2
  • Hardik Gediya
    • 2
  • Vivek K. Singh
    • 2
    Email author
  1. 1.Department of Mechanical EngineeringPDPUGandhinagarIndia
  2. 2.Space Applications Centre, Indian Space Research OrganisationAhmedabadIndia

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