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Computational Modeling and Parametric Analysis of an Implantable Patch Antenna Using Finite-Difference Time-Domain Algorithm

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Smart Intelligent Computing and Applications

Part of the book series: Smart Innovation, Systems and Technologies ((SIST,volume 104))

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Abstract

A bio-compatible implantable microstrip patch antenna is designed and analyzed for Implant Communications Services using the finite-difference time-domain (FDTD) method. The space in the patch area of the basic spiral antenna is efficiently used and hence modified. Here, the modified antenna represents a simple structure and is found to have higher gain, lower return loss, lower specific absorption rate (SAR), and a high radiation efficiency of about 73%. The performance characteristics of the antenna have also been evaluated using FEKO software, and the results are compared.

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Authors and Affiliations

  1. Department of Electrical Technology, Karunya Institute of Technology & Sciences, Coimbatore, 641114, Tamil Nadu, India

    T. Mary Neebha, M. Nesasudha & Evangelin Chrysolite

Authors
  1. T. Mary Neebha
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  2. M. Nesasudha
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  3. Evangelin Chrysolite
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Corresponding author

Correspondence to T. Mary Neebha .

Editor information

Editors and Affiliations

  1. School of Computer Engineering, KIIT Deemed to be University, Bhubaneswar, Odisha, India

    Suresh Chandra Satapathy

  2. Department of Electronics and Communication Engineering, Shri Ramswaroop Memorial Group of Professional Colleges, Lucknow, Uttar Pradesh, India

    Vikrant Bhateja

  3. Electronics and Communication Sciences Unit, Indian Statistical Institute, Kolkata, West Bengal, India

    Swagatam Das

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Mary Neebha, T., Nesasudha, M., Chrysolite, E. (2019). Computational Modeling and Parametric Analysis of an Implantable Patch Antenna Using Finite-Difference Time-Domain Algorithm. In: Satapathy, S., Bhateja, V., Das, S. (eds) Smart Intelligent Computing and Applications . Smart Innovation, Systems and Technologies, vol 104. Springer, Singapore. https://doi.org/10.1007/978-981-13-1921-1_11

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  • DOI: https://doi.org/10.1007/978-981-13-1921-1_11

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-1920-4

  • Online ISBN: 978-981-13-1921-1

  • eBook Packages: EngineeringEngineering (R0)

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