Abstract
This paper intends to reduce functional test time of the integrated circuit (IC) device in high temperature condition so that the test capacity can be increased to support customer demand. The root cause of this problem is that there is a waste time which is the setup time for changeover between the ambient temperature testing condition and the high temperature testing condition. The use of self-heating within IC device by inputting some bias currents to diode instead of using external heater can help us to reduce the setup time effectively. There are two experiments in this paper. The first experiment aims to find an optimal ratio of current (IH/IL) for measuring the die temperature. The result shows that the optimal ratio is 6:1. Next, a general full factorial design to determine the optimal parameters for self-heating IC device is performed and found that the 80% of designed current limit and 500 ms of input time are the suitable process parameters. After implementation, the functional test time can be reduced by 7.29% of working time per day.
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Acknowledgements
This research was supported by Faculty of Engineering, King Mongkut’s University of Technology North Bangkok. This support is gratefully acknowledged.
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Asawarungsaengkul, K., Chitharn, S. (2019). Productivity Improvement on Functional Test of Integrated Circuits Device Under High Temperature Condition. In: Abawajy, J., Othman, M., Ghazali, R., Deris, M., Mahdin, H., Herawan, T. (eds) Proceedings of the International Conference on Data Engineering 2015 (DaEng-2015) . Lecture Notes in Electrical Engineering, vol 520. Springer, Singapore. https://doi.org/10.1007/978-981-13-1799-6_35
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DOI: https://doi.org/10.1007/978-981-13-1799-6_35
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