Interfacial Science in Metal–Ceramic Joining for Thermoelectric Module

  • S. StalinEmail author
  • K. Kalaichelvan
  • T. Sujitha
Conference paper
Part of the Lecture Notes in Mechanical Engineering book series (LNME)


Achieving high reliable metal–ceramic joint is dependent on both interfacial bond strength and favorable stress gradient in the interface. The work is based on comparative study of the various metal–ceramic combinations: copper with aluminum nitride and nickel with nitride to identify the best for the required operating temperature of thermoelectric module. The use of CuSil ABA alloy in paste form and a brazing alloy was prepared in-house with the same composition as that of CuSil ABA alloy was separately used for bonding metal interconnect and ceramic substrate. The microstructural analysis and study of thermal loss of the bonded substrate were studied. The comparisons of microstructures of different combinations suggest that the bonding of Cu with alumina is more effective when compared to AlN, since the interface forms a continuous TiOX reaction layer over the ceramic surface. The microstructure of post-thermal gradient tested sample is evaluated for the presence of flaws when the hot side temperature is 300 °C, which is significant suggesting the quality of the interface needs further improvement.


Metal–ceramic bonding Brazing Microstructure characterization Thermal gradient measurement 



The authors are thankful to International Advanced Research Centre for Powder Metallurgy and New Materials, Chennai, DST-PURSE and Anna University, Chennai.


  1. 1.
    LeBlanc, S.: Thermoelectric generators: linking material properties and systems engineering for waste heat recovery applications. Sustain. Mater. Technol. 12, 26–35 (2014)Google Scholar
  2. 2.
    Barako, Michael T., Park, Woosung, Morconnet, Amy M., Asheghi, Mehdi, Goodson, Kenneth E.: A reliability study with infrared imaging of thermoelectric modules under thermal cycling. IEEE Xplore (2012).,86-92CrossRefGoogle Scholar
  3. 3.
    Liu, G.W., Li, W., Qiao, G.J., Wang, H.J., Yang, J.F., Lu, T.J.: J. Alloys Compd. 470, 163–167 (2009)CrossRefGoogle Scholar
  4. 4.
    Rice, R.W.: Advances in Joining, vol. 69. Brook Hiu Publications, Chestnut Hill, MA (1976)Google Scholar
  5. 5.
    Schilm, J., Pönicke, A., Kluge, M., Sichert, I., Martin, H.-P., Michaelis, A.: TiOx based thermoelectric modules—manufacturing. Prop. Oper. Beh. Mater. Today Proc. 2, 770–779 (2015)CrossRefGoogle Scholar
  6. 6.
    Akselsen, O.M.: Advances in brazing of ceramics. J. Mater. Sci. 27, 1989–2000 (1992)CrossRefGoogle Scholar
  7. 7.
    Mondal, S., Pathak, L.C., Venkateswarlu, K., Das, S.K., Ray, A.K.: Development and characterization of Ag-Cu-Ti alloys for ceramic brazing. Trans. Indian Ceramic Soc. 63, 9–13 (2004)Google Scholar
  8. 8.
    Kozlova, O., Voytovych, R., Eustathopoulos, N.: Initial stages of wetting of alumina by reactive CuAgTi alloys. Scripta Mater. 65, 13–16 (2011)CrossRefGoogle Scholar
  9. 9.
    Yadav, D.P., Kaul, R., Ganesh, P., Ram Shiroman, Sridhar, R., Kukreja, L.M.: Study on vacuum brazing of high purity alumina for application in proton synchrotron. Mater. Des. 64, 415–422 (2014)Google Scholar
  10. 10.
    Beeranur, R., Waghmare, K.K., Kumar Singh, R.: Characterization of vacuum brazing of SS304 and alumina ceramics with active brazing alloy. Proc. Mater. Sci. 5, 969–977 (2014)CrossRefGoogle Scholar
  11. 11.
    Rongti, L., Wei, P., Jian, C., Jie, L.: Thermodynamic properties of Ti in Ag–Cu–Ti alloys. Mater. Sci. Eng., A 335, 21–25 (2002)CrossRefGoogle Scholar
  12. 12.
    Wu, M., Cao, C., Xin-bo, H., Qu, X.: Brazing diamond/Cu composite to alumina using reactive Ag-Cu-Ti alloy. Trans. Nonferrous Met. Soc. China 23, 1701–1708 (2013)Google Scholar
  13. 13.
    Ismail, B.I., Ahmed, W.H.: Recent Pat. Electrical Eng. 2, 27–39 (2009)CrossRefGoogle Scholar
  14. 14.
    Roberts, P.M.: Introduction to Brazing Technology, pp. 158–165. Taylor & Francis, CRC (2016)Google Scholar
  15. 15.
    Kar, A., Palit Sagar, S., Ray, A.K.: Characterization of interface of Al2O3-SS braze joint. J. Mater. Charact. 58, 555–562 (2007)Google Scholar
  16. 16.
    Nicholas, M.G.: Active Metal Brazing, 1st edn, pp. 73–92. Springer US (1990)Google Scholar

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© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  1. 1.Department of Ceramic TechnologyACT Campus—Anna UniversityChennaiIndia

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