Abstract
Silicon material has been extensively used in electronics, optoelectronics, and Microelectromechanical Systems (MEMS). In spite of good mechanical behavior exhibited by the silicon material, their brittleness causes difficulty in machining, which greatly affects the surface integrity of the machined parts. This demands a need for further investigations in this area for improving the material removal rate and surface integrity. Ultrashort-pulsed laser machining techniques have brought new perspectives for efficient machining of semiconductor materials in terms of surface integrity and energy consumption. In the present work, the effect of number of pulses and repetition rate at 1064 and 532 nm wavelengths of a picosecond laser has been investigated for dimensional quality and subsurface defects of holes. Further experiments were conducted using a femtosecond laser to understand the effect of repetition rate, pulse duration, pulse energy, and scanning speed on the quality of kerf surface.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Bovatsek, J.M., Patel, R.S.: Highest-speed dicing of thin silicon wafers with nanosecond-pulse 355 nm q-switched laser source using line-focus fluence optimization technique. Laser-based Micro-and Nanopackaging and Assembly IV, 23 Feb 2010
Charee, W., Tangwarodomnukun, V., Dumkum, C.: Ultrasonic-assisted underwater laser micromachining of silicon. J. Mater. Process. Technol. 231, 209–220 (2016)
Ding, P.J., Liu, Q.C., Lua, X., Liu, X.L., Sun, S.H., Liu, Z.Y., Hua, B.T., Li, Y.H.: Hydrodynamic simulation of silicon ablation by ultrashort laser irradiation. Nucl. Instrum. Methods Phys. Res. B 286, 40–44 (2012)
Dong, Y., Molian, P.: Femtosecond pulsed laser ablation of 3C–SiC thin film on silicon. Appl. Phys. A Mater. Sci. Process. 77, 839–846 (2003)
Finn, D.S., Lin, Z., Kleinert, J., Darwin, M.J., Zhang, H.: Study of die break strength and heat-affected zone for laser processing of thin silicon wafers. 27(3), 032004(1–8) (2015)
Gonzalez, J.J., Fernandez, A., Oropeza, D., Mao, X., Russo, R.E.: Femtosecond laser ablation: experimental study of the repetition rate influence on inductively coupled plasma mass spectrometry performance. Spectrochim. Acta Part B 63, 277–286 (2008)
Hamad, A.H.: Laser Pulse Regimes (Nanosecond, Picosecond and Femtosecond) on the Ablation of Materials for Production of Nanoparticles in Liquid Solution, High Energy and Short Pulse Lasers. InTech, London (2016)
Jain, V.K.: In: Jain, V.K. (ed.) Micromanufacturing Processes. Taylor and Francis, Abingdon (2013)
Knowles, M.R.H., Rutterford, G., Karnakis, D., Ferguson, A.: Micro-machining of metals, ceramics and polymers using nanosecond lasers. Int. J. Manuf. Technol. 33, 95–102 (2007)
Li, T., Zhou, C., Liu, Z., Wang, W.: Computational and experimental study of nanosecond laser ablation of crystalline silicon. Int. Commun. Heat Mass Transf. 38, 1041–1043 (2011)
Mirza, I., Bulgakova, N.M., Tomáštík, J., Michálek, V., Haderka, O., Fekete, L., Mocek, T.: Ultrashort pulse laser ablation of dielectrics: Thresholds, mechanisms, role of breakdown. Scientific Rep. 6, 1–11 (2016)
Perry, M.D., Stuart, B.C., Banks, P.S., Nguyen, H.T., Feit M.D.: Ultashort-pulse laser machining. In: International Congress of Applications of Lasers and Electro-optics, 16–19 Nov 1998
Riberio, R.M., Ramos, M.M.D., Stoneham, A.M., Pires J.M.C.: Modelling of surface evaporation by laser ablation. Appl. Surf. Sci. 109/110, 158–161 (1997)
Romashevskiy, S.A., Ashitkov, S.I., Dmitriev, A.S.: Formation of ordered nano-and mesostructures in silicon irradiated with a single femtosecond laser pulse in different environments. Tech. Phys. Lett. 42(8), 810–813 (2016)
Rosenfeld, D., Ashkenasi, E., Campbell, E.E.B., Lorenz, M., Stoian, R., Varel, H.: Material processing with femtosecond laser pulses. In: Proceedings of the International Conference on Lasers-Society for Optical and Quantum Electronics, pp 7–23. Society for optical and quantum electronics, (1998)
Rublack, T., Muchow, M., Hartnauer, S., Seifert, G.: Laser ablation of silicon dioxide on silicon using femtosecond near infrared laser pulses. Energy Proc. 8, 467–472 (2011)
Schutz, V., Stute, U., Horn, A.: Thermodynamic investigations on the laser ablation rate of silicon over five fluence decades. Phys. Procedia. 41, 640–649 (2013)
Sotnikov, A., Laux, H., Stritzker, B.: Experimental and numerical optimization of beam shapes for short-pulse ultraviolet laser cutting processing. Phys. Proc. 5, 137–146 (2010)
Talbi, A., Petit, A., Melhem, A., Stolz, A., Boulmer-Leborgne, C., Gautier, G., Defforge, T., Semmar, N.: Nanoparticles based laser-induced surface structures formation on mesoporous silicon by picosecond laser beam interaction. Appl. Surf. Sci. 374, 31–35 (2016)
Tan, B., Panchatsharam, S., Venkatakrishnan, K.: High repetition rate femtosecond laser forming sub-10 μm diameter interconnection vias. J. Phys. D Appl. Phys. 42(6), 065102 (2009)
Tangwarodomnukun, V., Wang, J., Huang, C.Z., Zhu, H.T.: Heating and material removal process in hybrid laser-water jet ablation of silicon substrates. Int. J. Mach. Tools Manuf. 79, 1–16 (2014)
Zhang, Y., Li, S., Chen, G., Mazumder, J.: Experimental observation and simulation of keyhole dynamics during laser drilling. Opt. Laser Technol. 48, 405–414 (2013)
Acknowledgements
The work was accomplished with the help of the facilities provided by the Department of Physics, Photonics laboratory of IIT Madras, Chennai and ARCI, Hyderabad, India.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2019 Springer Nature Singapore Pte Ltd.
About this paper
Cite this paper
Singh, S., Samuel, G.L. (2019). Laser Micromachining of Semiconductor Materials. In: Dixit, U., Joshi, S., Davim, J. (eds) Application of Lasers in Manufacturing. Lecture Notes on Multidisciplinary Industrial Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-13-0556-6_6
Download citation
DOI: https://doi.org/10.1007/978-981-13-0556-6_6
Published:
Publisher Name: Springer, Singapore
Print ISBN: 978-981-13-0555-9
Online ISBN: 978-981-13-0556-6
eBook Packages: EngineeringEngineering (R0)