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Dielectric Properties of Cu/Epoxy Random Composites at Radio-Frequency Range

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Abstract

Cu/epoxy composites with the different volume fraction of Cu were prepared through hot press process. The conductivity and dielectric properties of the Cu/epoxy composite were investigated. The analyze of the results indicated that the real part of permittivity \( \varepsilon _{r}^{{\prime }} \) of Cu/epoxy composites increased when copper content increased, which is caused by the increasing interface connect between Cu fillers and epoxy partials. The frequency dispersions of ac conductivity follow the power law and thus indicates the hopping conduction behavior in composites.

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Acknowledgements

The authors gratefully acknowledge the support of the National Natural Science Foundation of China [grant No. 51402170], Young Scholars Program of Shandong University [grant No. 2016WLJH40].

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Authors and Affiliations

  1. Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, Jinan, 250061, China

    Ciqun Xu, Peitao Xie, Yunpeng Qu, Yulin Wu, Jiaqi Chen, Huan Ren & Yao Liu

  2. Dezhou META Research Center for Innovative Materials, Dezhou, 253000, China

    Ciqun Xu, Peitao Xie, Yunpeng Qu, Jiaqi Chen, Huan Ren & Yao Liu

Authors
  1. Ciqun Xu
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  2. Peitao Xie
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  3. Yunpeng Qu
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  4. Yulin Wu
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  5. Jiaqi Chen
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  6. Huan Ren
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  7. Yao Liu
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Corresponding author

Correspondence to Yao Liu .

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Editors and Affiliations

  1. Chinese Materials Research Society, Beijing, China

    Yafang Han

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Xu, C. et al. (2018). Dielectric Properties of Cu/Epoxy Random Composites at Radio-Frequency Range. In: Han, Y. (eds) Advanced Functional Materials. CMC 2017. Springer, Singapore. https://doi.org/10.1007/978-981-13-0110-0_5

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