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Influence of Process Parameters by Enclosed Cooling Slope Channel on Microstructures of Semi-solid ZCuSn10P1 Alloy

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Advances in Materials Processing (CMC 2017)

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Abstract

Semi-solid ZCuSn10P1 alloy slurry was fabricated by a novel enclosed cooling slope channel (ECSC for short). The influence of process parameters on the microstructure and Tin segregation phenomenon of ZCuSn10P1 alloy semi-solid slurry was studied with optical microscope (OM), scanning electron microscope (SEM) and energy dispersive x-ray spectrum (EDS). The results showed that the primary α-Cu phase gradually evolved from the dendrite into worm-like or fine spherical crystal under chilling of ECSC and shearing of the gravitation. The finest microstructure, the equivalent diameter was 46 ± 3 μm, and its shape factor was 0.73, could be obtained under the conditions of the pouring temperature 1080 °C, 300 mm of cooling plate inclined at 45 degrees and 5 mm flow gap. The average concentration of Tin increased from 5.85% in the conventional casting to 6.46% in semi-solid slurry in primary α-Cu phase, and the average concentration of Tin decreased from 27.94% in the conventional casting to 20.59% in semi-solid slurry in liquid. The distribution of Tin element in microstructure was refined obviously and the dendrite segregation reduced.

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Acknowledgements

The authors acknowledge funding for the research from National Science Foundation of China (51765026) and (51505205), Science and Technology Project Foundation of Yunnan Province of China (2015Y058). This work is supported by the Advanced Solidification forming and Equipment Technology National Joint Local Engineering Laboratory, Kunming University of Science and Technology, Kunming, China.

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Correspondence to Rongfeng Zhou .

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Li, Y., Zhou, R., Li, L., Xiao, F., Jiang, Y., Lu, D. (2018). Influence of Process Parameters by Enclosed Cooling Slope Channel on Microstructures of Semi-solid ZCuSn10P1 Alloy. In: Han, Y. (eds) Advances in Materials Processing. CMC 2017. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-13-0107-0_55

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  • DOI: https://doi.org/10.1007/978-981-13-0107-0_55

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