Microstructure and Thermal Properties of SiC/Al Composites for Electronic Packaging

Abstract

The SiC particles reinforced aluminum matrix composites for electronic packaging was prepared by using pressureless infiltration. The microstructures and thermal properties were investigated. The results shown that the composites were free of porosity, the SiC particles were distributed uniformly and which interfaces were well controlled. The bending strength was less affected by different loading speeds, the experimental results shown that the average bending strength was more than 360 MPa. By studying the fracture surface of bending specimens, the SiC particles were brittle cleavage fracture and the matrix was ductile tough fracture. The thermal performance test results indicated that the coefficient of linear expansion increased first and then decreasing with the temperature rising, and the maximum value is 8.25 × 10⁻⁶ K⁻¹ near 300 °C. The thermal conductivity decreased gradually, when the temperature is 25 °C, the maximum thermal conductivity was 225.7 W m⁻¹ K⁻¹, and the density was 2.95 g/cm³, meet the requirements of electronic packaging materials.