Microstructure and Properties of Spray-Formed Si–30Al Alloy Used for Electronic Packaging
The microstructure and properties of spray-formed Si–30Al alloy was studied in this paper, which was used for electronic packaging. Hot isostatic pressing was used to compact the ingot, and then electroplating and brazing was carried out. The results showed that, (1) the Si–30Al alloy comprised α-Al phase, pseudo eutectic phase and primary silicon phase; (2) the flow deformation of α-Al phase and pseudo eutectic phase filled pore defect making the alloy compacting by HIP; (3) the alloy could be electroplated and brazed easily, and no pore defect was observed in electroplated coating and weld.
KeywordsSpray-formed Si–30Al alloy Electronic packaging Microstructure Properties
This study was financially supported by the National Key Research and Development Program of China (No. 2016YFB0300803 and No. 2016YFB0300903).
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