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The Advances in Joining Technology pp 97–107Cite as

A Review on Mechanical Properties of SnAgCu/Cu Joint Using Laser Soldering

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Part of the book series: Lecture Notes in Mechanical Engineering ((LNME))

Abstract

This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu (SAC) solder and Copper substrate after laser soldering. This involved on basic principles of solder alloy and Copper diffusion mechanism. In addition, this paper also reviews laser solder effects towards mechanical properties of the solder joint. This paper approach on the review of the solder joint strength which regards to intermetallic compound type and thickness. The output of this paper is to create an understanding for the readers about variance of laser soldering parameters and its effect on the mechanical properties of the solder joint by including discussion from other research paper findings.

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References

  1. Hwang JS (2012) Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly. Springer, Netherlands

    Google Scholar 

  2. Silvera J (2012) Soldering made simple: easy techniques for the kitchen-table jeweler. Kalmbach Publishing Company, Books Division, Waukesha

    Google Scholar 

  3. Rao (2011) Manufacturing technology: foundry, forming and welding,2e. McGraw-Hill, New York

    Google Scholar 

  4. Frear DR, Burchett SN, Morgan HS, Lau JH (1994) Mechanics of solder alloy interconnects. Springer, US

    Google Scholar 

  5. Gnecco F, Ricci E, Amore S, Giuranno D, Borzone G, Zanicchi G, Novakovic R (2007) Wetting behaviour and reactivity of lead free Au–In–Sn and Bi–In–Sn alloys on copper substrates. Int J Adhes Adhes 27(5):409–416

    Article  Google Scholar 

  6. Novakovic R, Lanata T, Delsante S, Borzone G (2012) Interfacial reactions in the Sb–Sn/(Cu, Ni) systems: wetting experiments. Mater Chem Phys 137(2):458–465

    Article  Google Scholar 

  7. Yang ZJ, Yang SM, Yu HS, Kang SJ, Song JH, Kim KJ (2014) IMC and creep behavior in lead-free solder joints of Sn–Ag and Sn–Ag–Cu alloy system by SP method. Int J Automot Technol 15(7):1137–1142

    Article  Google Scholar 

  8. Yu DQ, Wu CML, Law CMT, Wang L, Lai JKL (2005) Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method. J Alloy Compd 392(1):192–199

    Article  Google Scholar 

  9. Kim J-O, Jung J-P, Lee J-H, Jeong S, Kang H-S (2009) Effects of laser parameters on the characteristics of a Sn–3.5 wt%Ag solder joint. Met Mater Int 15(1):119–123

    Article  Google Scholar 

  10. Illyefalvi-Vitez Z, Balogh B, Baranyay Z, Farmer G, Harvey T, Kirkpatrik D, Kotora G, Ruzsics N (2007) Laser soldering for lead-free assembly. In: ISSE 2007—30th international spring seminar on electronics technology 2007; conference proceedings: emerging technologies for electronics packaging, pp 471–476

    Google Scholar 

  11. Wang M, Wang J, Ke W (2017) Corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder joints. Microelectron Reliab 73:69–75

    Article  Google Scholar 

  12. Abd El-Rehim AF, Zahran HY (2017) Investigation of microstructure and mechanical properties of Sn–xCu solder alloys. J Alloy Compd 695:3666–3673

    Article  Google Scholar 

  13. Zeng G, Xue S, Zhang L, Gao L, Lai Z, Luo J (2010) Properties and microstructure of Sn–0.7Cu–0.05Ni solder bearing rare earth element Pr. J Mater Sci: Mater Electron 22(8):1101–1108

    Google Scholar 

  14. Zeng G, Xue S, Zhang L, Gao L (2011) Recent advances on Sn–Cu solders with alloying elements: review. J Mater Sci: Mater Electron 22(6):565–578

    Google Scholar 

  15. Cheng S, Huang C-M, Pecht M (2017) A review of lead-free solders for electronics applications. Microelectron Reliab 75:77–95

    Article  Google Scholar 

  16. Yao P, Li X, Liang X, Yu B (2017) Investigation of soldering process and interfacial microstructure evolution for the formation of full Cu3Sn joints in electronic packaging. Mater Sci Semicond Process 58(Nov 2016):39–50

    Article  Google Scholar 

  17. Kibushi R, Hatakyeama T, Imai D, Nakagawa S, Ishizuka M (2013) Optimal laser condition for laser soldering in cream and ring solder. In: 2013 IEEE 3rd CPMT symposium Japan (ICSJ 2013)

    Google Scholar 

  18. Ervina EMN, Aisyah MA (2012) A review of solder evolution in electronic application. Int J Eng Appl Sci 1(1):1–10

    Google Scholar 

  19. Nishikawa H, Iwata N, Takemoto T (2011) Effect of heating method on microstructure of Sn–3.0Ag–0.5Cu solder on Cu substrate

    Google Scholar 

  20. Hamada N, Uesugi T, Takigawa Y, Higashi K (2012) Effects of Zn addition and aging treatment on tensile properties of Sn–Ag–Cu alloys. J Alloys Compd 527(Supplement C):226–232

    Article  Google Scholar 

  21. Nicolics J (1992) Optimization of process parameters for laser soldering of surface mounted devices 15(6):1155–1159

    Google Scholar 

  22. Han Z-J, Xue S-B, Wang J-X, Xin Z (2008) Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology. Trans Nonferrous Met Soc China, 2–6

    Article  Google Scholar 

  23. Wang J-X, Xue S-B, Fang D-S, Ju J-L, Han Z-J, Yao L-H (2006) Effect of diode-laser parameters on shear force of micro-joints soldered with Sn–Ag–Cu lead-free solder on Au/Ni/Cu pad. Trans Nonferrous Met Soc China 16:1374–1378

    Article  Google Scholar 

  24. Liu W, Wang CQ, Tian YH (2008) Effect of laser input energy on AuSn X intermetallic compounds formation in solder joints with different thickness of Au surface finish on pads. Acta Metall Sinica (English Letters) 21(3):183–190

    Article  Google Scholar 

  25. Nishikawa H, Iwata N (2015) Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu pad. J Mater Process Technol 215(Supplement C):6–11

    Article  Google Scholar 

  26. Bunea R, Svasta P (2011) Optimizing laser soldering of SMD components: from theory to practice, pp 55–58

    Google Scholar 

  27. Lu D, Wong CP (2016) Materials for advanced packaging. Springer International Publishing, Cham

    Google Scholar 

  28. Hare E (2013) Intermetallics in solder joints. http://www.semlab.com/papers, SEMLab Inc

  29. Kang TY, Xiu YY, Hui L, Wang JJ, Tong WP, Liu CZ (2011) Effect of bismuth on intermetallic compound growth in lead free solder/cu microelectronic interconnect. J Mater Sci Technol 27(8):741–745

    Article  Google Scholar 

  30. Flanagan A, Conneely A, Glynn TJ, Lowe G (1996) materials processing technology fine pitch electronic components. J Mater Process Technol 0136:531–541

    Article  Google Scholar 

  31. Chung DDL (1995) Materials for electronic packaging. Elsevier Science, New York

    Google Scholar 

  32. Liu P, Yao P, Liu J (2009) Effects of multiple reflows on interfacial reaction and shear strength of SnAgCu and SnPb solder joints with different PCB surface finishes. J Alloy Compd 470(1):188–194

    Article  Google Scholar 

  33. Noh BI, Koo JM, KIm JW, Kim DG, Nam JD, Joo J, Jung SB (2006) Effects of number of reflows on the mechanical and electrical properties of BGA package. Intermetallics 14(10):1375–1378

    Article  Google Scholar 

  34. Ma HR, Wang YP, Chen J, Ma HT, Zhao N (2017) The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows, pp 1402–1405

    Google Scholar 

  35. Ion J (2005) Laser processing of engineering materials: principles, procedures and industrial applications. pp 335

    Chapter  Google Scholar 

  36. Ogochukwu ES (2013) Laser soldering. In: Y. Mastai, Rijeka (ed) Materials Science - Advanced Topics. InTech, 2013, p Ch 15

    Google Scholar 

  37. Dawson JW (2012) Fiber lasers: technology, applications and associated laser safety. Article

    Google Scholar 

  38. Qin Y (2010) Micromanufacturing engineering and technology. Elsevier Science, New York

    Google Scholar 

  39. Majumdar JD, Manna I (2012) Laser-assisted fabrication of materials. Springer, Berlin

    Google Scholar 

  40. Liu J, Ma H, Li S, Sun J, Kunwar A, Miao W, Hao J, Bao Y (2014) The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu laser soldering. In: 2014 15th international conference on electronic packaging technology

    Google Scholar 

  41. Yang M, Yang S, Ji H, Ko Y-H, Lee C-W, Wu J, Li M (2016) Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method. J Mater Process Technol 236(Supplement C):84–92

    Article  Google Scholar 

  42. An L, Ma H, Qu L, Wang J, Liu J, Huang M (2013) The effect of laser-soldering parameters on the Sn–Ag–Cu/Cu interfacial reaction. In: 2013 14th international conference on electronic packaging technology

    Google Scholar 

  43. Shang PJ, Liu ZQ, Pang XY, Li DX, Shang JK (2009) Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates. Acta Mater 57(16):4697–4706

    Article  Google Scholar 

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Authors and Affiliations

  1. Faculty of Mechanical Engineering, University Malaysia Pahang, 26600, Pekan, Pahang, Malaysia

    Nabila Tamar Jaya, Siti Rabiatull Aisha Idris & Mahadzir Ishak

Authors
  1. Nabila Tamar Jaya
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  2. Siti Rabiatull Aisha Idris
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  3. Mahadzir Ishak
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Corresponding author

Correspondence to Siti Rabiatull Aisha Idris .

Editor information

Editors and Affiliations

  1. Department of Mechanical Engineering, Universiti Teknologi PETRONAS, Seri Iskandar, Malaysia

    Mokhtar Awang

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Cite this paper

Jaya, N.T., Idris, S.R.A., Ishak, M. (2019). A Review on Mechanical Properties of SnAgCu/Cu Joint Using Laser Soldering. In: Awang, M. (eds) The Advances in Joining Technology. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-10-9041-7_8

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  • DOI: https://doi.org/10.1007/978-981-10-9041-7_8

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-10-9040-0

  • Online ISBN: 978-981-10-9041-7

  • eBook Packages: EngineeringEngineering (R0)

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