FOWLP: PoP

Chapter

Abstract

Package-on-package (PoP) has been used for housing the application processor (AP) chipset for a few years as shown in Fig.  2.17. Usually, the top package is used to house the mobile memory and the bottom package is used to house the AP. STATS ChipPAC proposed a PoP for the AP chipset with the FOWLP technology (Eslampour et al in IEEE/ECTC proceedings, 1946–1950, [1]; Yoon et al. in Proceedings of IEEE/ECTC, 1250–1254, [2]).

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Copyright information

© Springer Nature Singapore Pte Ltd. 2018

Authors and Affiliations

  1. 1.ASM Pacific TechnologyHong KongHong Kong

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