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Fan-in Wafer-Level Packaging Versus FOWLP

  • John H. Lau
Chapter

Abstract

Fan-in wafer-level packaging (WLP) technology will be discussed in this chapter. A wafer-level chip scale package (WLCSP) will be designed and fabricated, and then assembled on a printed circuit board (PCB). Emphasis is placed on the key process steps in making the redistribution layer (RDL) of the WLCSP and its PCB solder joint reliability.

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Copyright information

© Springer Nature Singapore Pte Ltd. 2018

Authors and Affiliations

  1. 1.ASM Pacific TechnologyHong KongHong Kong

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