Abstract
In this chapter, a flip chip is defined (Lau in Flip Chip Technologies. McGraw-Hill, New York, 1996 [1]; Lau in Low Cost Flip Chip Technologies. McGraw-Hill, New York, 2000 [2]; Lau et al. in Electronic Packaging. McGraw-Hill, New York, 1998 [3]; Lau in Electronic Manufacturing. McGraw-Hill, New York, 2003 [4]) as a chip attached to the pads of a substrate or another chip with various interconnect materials (e.g., Sn–Pb, Cu, Au, Ag, Ni, In, and isotropic or anisotropic conductive adhesives) and methods [e.g., mass reflow and thermocompression bonding (TCB)], as long as the chip surface (active area or I/O side) is facing the substrate or another chip as shown in Fig. 2.1.
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References
Lau, J.H. (ed.). 1996. Flip Chip Technologies. New York: McGraw-Hill.
Lau, J.H. 2000. Low Cost Flip Chip Technologies. New York: McGraw-Hill.
Lau, J.H., C. Wong, J. Prince, and W. Nakayama. 1998. Electronic Packaging. New York: McGraw-Hill.
Lau, J.H., N. Lee, C. Wong, and R. Lee. 2003. Electronic Manufacturing. New York: McGraw-Hill.
Davis, E., W. Harding, R. Schwartz, and J. Corning. 1964. Solid Logic Technology: Versatile, High Performance Microelectronics. IBM Journal of Research and Development 8 (2): 102–114.
Totta, P., and R. Sopher. 1969. SLT Device Metallurgy and Its Monolithic Extension. IBM Journal of Research and Development 13 (3): 226–238.
Lau, J.H. 2016. 3D IC Integration and Packaging. New York: McGraw-Hill.
Lau, J.H. 2013. Through-Silicon Vias for 3D Integration. New York: McGraw-Hill.
Lau, J.H. 2011. Reliability of RoHS-Compliant 2D and 3D IC Interconnects. New York: McGraw-Hill.
Lau, J.H., C. Lee, C. Premachandran, and A. Yu. 2010. Advanced MEMS Packaging. New York: McGraw-Hill.
Lim, S., V. Rao, W. Hnin, W. Ching, V. Kripesh, C. Lee, J.H. Lau, J. Milla, and A. Fenner. 2010. Process Development and Reliability of Microbumps. IEEE Transactions on CPMT 33 (4): 747–753.
Sutanto, J. 2012. POSSUMTM Die Design as a Low Cost 3D Packaging Alternative. 3D Packag 25, 16–18.
Lau, J.H. 2015. Patent Issues of Fan-Out Wafer/Panel-Level Packaging. Chip Scale Review 19 (6): 42–46.
Lau, J.H., N. Fan, and M. Li. 2016. Design, Material, Process, and Equipment of Embedded Fan-Out Wafer/Panel-Level Packaging. Chip Scale Review 20 (3): 38–44.
Lau, J.H., T. Chung, R. Lee, C. Chang, and C. Chen. 1999. A Novel and Reliable Wafer-Level Chip Scale Package (WLCSP). In Chip Scale International Conference, San Jose, CA, September 14–15, 1999, H1–8.
Elenius, P., and H. Yang. 1998. The Ultra CSP Wafer-Scale Package. In High Density Interconnect Conference and Expo, Tempe, AZ, September 15–16, 1998, 36–40.
Lau, J.H., and S.W.R. Lee. 1999. Chip Scale Package. New York: McGraw-Hill.
Lau, J.H., and Y. Pao. 1997. Solder Joint Reliability of BGA, CSP, and Flip Chip Assemblies. New York: McGraw-Hill.
Lau, J.H., and C. Chang. 2000. Taguchi Design of Experiment for Wafer Bumping by Stencil Printing. IEEE Transactions on Electronics Packaging Manufacturing 21 (3): 219–225.
Elenius, P. 1998. Flip Chip Bumping for IC Packaging Contractors. In NEPCON West Conference, Anaheim, CA, March 3–5, 1998, 1403–1407.
Elenius, P., J. Leal, J. Ney, D. Stepniak, and S. Yeh. 1999. Recent Advances in Flip Chip Wafer Bumping Using Solder Paste Technology. In IEEE 49th Electronic Components and Technology Conference, San Diego, CA, June 1–4, 1999, 260–265.
Li, L., S. Wiegele, P. Thompson, and R. Lee. 1998. Stencil Printing Process Development for Low Cost Flip Chip Interconnect. In IEEE 48th Electronic Components and Technology Conference, Seattle, WA, May 25–28, 1998, 421–426.
Wiegele, S., P. Thompson, R. Lee, and E. Ramsland. 1998. Reliability and Process Characterization of Electroless Nickel-Gold/Solder Flip Chip Interconnect Technology. In 48th Electronic Components and Technology Conference, Seattle, WA, May 25–28, 1998, 861–866.
Kloeser, J., K. Heinricht, E. Jung, L. Lauter, A. Ostmann, R. Aschenbrenner, and H. Reichl. 1998. Low Cost Bumping by Stencil Printing: Process Qualification for 200 mm Pitch. In International Symposium on Microelectronics, San Diego, CA, November 1–4, 1998, 288–297.
Cho, M., S. Kang, Y. Kwon, D. Jang, and N. Kim. 1999. Flip-Chip Bonding on PCB With Electroless Ni-Au and Stencil Printing Solder Bump. In SMTA International Conference, San Jose, CA, September 12–16, 1999, 159–164.
Love, D., L. Moresco, W. Chou, D. Horine, C. Wong, and S. Eilin. 1994. Wire Interconnect Structures for Connecting an Integrated Circuit to a Substrate. U.S. Patent No. 5,334,804, filed November 17, 1992 and issued August 2, 1994.
Tung, F. 2003. Pillar Connections for Semiconductor Chips and Method of Manufacture. U.S. Patent No. 6,578,754, filed April 27, 2000 and issued June 17, 2003.
Tung, F. 2004. Pillar Connections for Semiconductor Chips and Method of Manufacture. U.S. Patent No. 6,681,982, filed June 12, 2002 and issued January 27, 2004.
Cappo, F., J. Milliken, and J. Mosley. 1991. Highly Manufacturable Multi-Layered Ceramic Surface Mounted Package. In 11th IEEE/CHMT International Electronic Manufacturing Technology Symposium, San Francisco, CA, September 16–18, 1991, 424–428.
Banks, D., T. Burnette, R. Gerke, E. Mammo, and S. Mattay. 1994. Reliability Comparison of Two Metallurgies for Ceramic Ball Grid Array. In International Conference and Exhibition on Multichip Modules, Denver, CO, April 13–15, 1994, 529–534.
Sigliano, R., and K. Gaughan. 1992. Ceramic Material Options for MCM’s. In 1st International Conference on Multichip Modules, Denver, CO, April 1–3, 1992, 291–299.
Sigliano, R. 1995. Ceramic Substrates for Ball Grid Array Packages. In Ball Grid Array Technology, ed. J. H. Lau, 65–92. New York: McGraw-Hill.
Lau, J.H., and W. Dauksher. 2005. Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 96.5Sn3.9Ag0.6Cu Lead-Free Solder Paste on PCBs (Printed Circuit Boards). ASME Journal of Electronic Packaging 127 (2): 96–105.
Lau, J.H., T. Castello, D. Shangguan, W. Dauksher, J. Smetana, R. Horsley, D. Love, I. Menis, and B. Sullivan. 2007. Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package. IMAPS Transactions on Journal of Microelectronics and Electronic Packaging 4 (3): 189–213.
Tsukada, Y., S. Tsuchida, and Y. Mashimoto. 1992. Surface Laminar Circuit Packaging. In 42nd IEEE Electronic and Components Technology Conference, San Diego, CA, May 18–20, 1992, 22–27.
Tsukada, Y., and S. Tsuchida. 1992. Surface Laminar Circuit, a Low Cost High Density Printed Circuit Board. In Surface Mount International Conference, San Jose, CA, August 27–29, 1992, 537–542.
Tsukada, Y. 1994. Solder Bumped Flip Chip Attach on SLC Board and Multichip Module. In Chip on Board Technologies for Multichip Modules, ed. J. H. Lau, 410–443. New York: Van Nostrand Reinhold.
Tsukada, Y., Y. Maeda, and K. Yamanaka. 1993. A Novel Solution for MCM-L Utilizing Surface Laminar Circuit and Flip Chip Attach Technology. In Proceedings of 2nd International Conference on Multichip Modules, April 1993, 252–259.
Lau, J.H., and S.W.R. Lee. 2001. Microvias for Low Cost, High Density Interconnects. New York: McGraw-Hill.
Gonzalez, C., R. Wessel, and S. Padlewski. 1999. Epoxy-Based Aqueous Processable Photo Dielectric Dry Film and Conductive ViaPlug for PCB Build-Up and IC Packaging. IEEE Transactions on Advanced Packaging 22 (3): 385–390.
Burgess, L., and P. Madden. 1998. Blind Vias in SMD Pads. Printed Circuit Fabrication 21 (1): 28–29.
Castro, A. 1997. Chip Carrier Package Constructions Made Easier with Dry Film Photo Dielectric. In Proceedings from IPC Works, October 1997, S01-5-1.
Nargi-Toth, K., and P. Gandhi. 1998. Manufacturing Methodologies for High Density Interconnect Structures (HDIS). In CSI Technical Symposium, September 1998, 63–70.
Noddin, D., E. Swenson, and Y. Sun. 1998. Solid State UV-LASER Technology for the Manufacture of High Performance Organic Modules. In IEEE/ECTC Proceedings, May 1998, 822–827.
Cable, A. 1997. Improvements in High Speed Microvia Formation Using Solid State Nd:YAG UV Lasers. In IPC EXPO, March 1997, S-2.
Tessier, T., and J. Aday. 1995. Casting Light on Recent Advancements in Laser Based MCM-L Processing. In Proceedings of International Conference on Multichip Modules, April 1995, 6–13.
Illyefalvi-Vitez, Z., and J. Pinkola. 1997. Application of Laser Engraving for the Fabrication of Fine Resolution Printed Wiring Laminates for MCM-Ls. In IEEE/ECTC Proceedings, May 1997, 502–510.
Enomoto, R., M. Asai, and N. Hirose. 1998. High Density MLB using Additive and Build-up Process. In Proceddings of the International Symposium on Microelectronics, November 1998, 399–404.
Kobayashi, K., N. Katagiri, and S. Koyama. 1999. Development of a Build Up Package with High Density of Circuits for High Pin Count Flip Chip Application. In IPC EXPO, March 1999, S01–4.
Burgess, L., and F. Pauri. 1999. Optimizing BGA to PCB Interconnections Using Multi-Depth Laser Drilled Blind Vias-in-Pad. Circuit World 25 (2): 31–34.
Petefish, W., D. Noddin, and D. Hanson. 1998. High Density Organic Flip Chip Package Substrate Technology. In IEEE/ECTC Proceedings, May 1998, 1089–1097.
Li, L. 2004. Embedded Passives in Organic Substrate for RF Module and Assembly Characterization. In Proceedings of the 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, June 2004, 74–82.
Srinivasan, K., P. Muthana, R. Mandrekar, E. Engin, J. Choi, and M. Swaminathan. 2006. Enhancement of Signal Integrity and Power Integrity with Embedded Capacitors in High-Speed Packages. In Proceedings of the 7th International Symposium on Quality Electronic Design, March 2006, 286–291.
Pham, N., M. Cases, D. de Araujo, B. Mutnury, E. Matoglu, B. Herrman, and P. Patel. 2006. Embedded Capacitor in Power Distribution Design of High-End Server Packages. In IEEE/ECTC Proceedings, May 2006, 1677–1682.
Tanaka, H., T. Kariya, H. Nagata, K. Yoshikawa, K. Shimizu, H. Noauchi, and S. Kato. 2008. Embedded High-k Thin Film Capacitor in Organic Package. In IEEE/EPTC Proceedings, December 2008, 988–993.
Akahoshi, T., D. Mizutani, K. Fukui, S. Yamawaki, H. Fujisaki, M. Watanabe, and M. Koide. 2017. Development of CPU Package Embedded with Multilayer Thin Film Capacitor for Stabilization of Power Supply. In IEEE/ECTC Proceedings, May 2017, 179–184.
Lau, J.H., C. Chang, C. Chen, C. Ouyang, and R. Lee. 1999. Via-In-Pad (VIP) Substrates for Solder Bumped Flip Chip Applications. In Proceedings of the SMTA International Conference, September 1999, 128–136.
Lau, J.H., and C. Chang. 2000. An Overview of Microvia Technologies. Circuit World 26 (2): 22–32.
Schmidt, W. 1999. High Performance Microvia PWB and MCM Applications. In IPC EXPO, S17-5-1–S17-5-8.
Shimizu, N., W. Kaneda, H. Arisaka, N. Koizumi, S. Sunohara, A. Rokugawa, and T. Koyama. 2013. Development of Organic Multi Chip Package for High Performance Application. In IMAPS International Symposium on Microelectronics, Orlando, FL, September 30–October 3, 2013, 414–419.
Oi, K., S. Otake, N. Shimizu, S. Watanabe, Y. Kunimoto, T. Kurihara, T. Koyama, M. Tanaka, L. Aryasomayajula, and Z. Kutlu. 2014. Development of New 2.5D Package With Novel Integrated Organic Interposer Substrate With Ultra-Fine Wiring and High Density Bumps. In IEEE 64th Electronic and Components Technology Conference, Orlando, FL, May 27–30, 2014, 348–353.
Koide, M., K. Fukuzono, H. Yoshimura, T. Sato, K. Abe, and H. Fujisaki. 2006. High-Performance Flip-Chip BGA Technology Based on Thin-Core and Coreless Package Substrate. In IEEE 56th Electronic and Components Technology Conference, San Diego, CA, May 30–June 2, 2006, 1869–1873.
Sung, R., K. Chiang, Y. Wang, and C. Hsiao. 2007. Comparative Analysis of Electrical Performance on Coreless and Standard Flip-Chip Substrate. In IEEE 57th Electronic and Components Technology Conference, Reno, NV, May 29–June 1, 2007, 1921–1924.
Lin, E., D. Chang, D. Jiang, Y. Wang, and C. Hsiao. 2007. Advantage and Challenge of Coreless Flip-Chip BGA. In International Microsystems, Packaging, Assembly and Circuits Technology, Taipei, Taiwan, October 1–3, 2007, 346–349.
Chang, D., Y. Wang, and C. Hsiao. 2007. High Performance Coreless Flip-Chip BGA Packaging Technology. In IEEE 57th Electronic and Components Technology Conference, Reno, NV, May 29–June 1, 2007, 1765–1768.
Savic, J., P. Aria, J. Priest, N. Dugbartey, R. Pomerleau, B. Shanker, M. Nagar, J. Lim, S. Teng, L. Li, and J. Xue. 2009. Electrical Performance Assessment of Advanced Substrate Technologies for High Speed Networking Applications. In IEEE 59th Electronic and Components Technology Conference, San Diego, CA, May 26–29, 2009, 1193–1199.
Kurashina, M., D. Mizutani, M. Koide, and N. Itoh. 2009. Precision Improvement Study of Thermal Warpage Prediction Technology for LSI Packages. In IEEE 59th Electronic and Components Technology Conference, San Diego, CA, May 26–29, 2009, 529–534.
Wang, J., Y. Ding, L. Liao, P. Yang, Y. Lai, and A. Tseng. Coreless Substrate for High Performance Flip Chip Packaging,” IEEE 11th International Conference on Electronic Packaging Technology.
Kimura, M. 2011. Shinko Officially Announces Volume Production of Coreless Substrate. Nikkei Electronics.
Fujimoto, D., K. Yamada, N. Ogawa, H. Murai, H. Fukai, Y. Kaneato, and M. Kato. 2011. New Fine Line Fabrication Technology on Glass-Cloth Prepreg Without Insulating Films for KG Substrate. In IEEE 61st Electronic and Components Technology Conference, Lake Buena Vista, FL, May 31–June 3, 2011, 387–391.
Kim, G., S. Lee, J. Yu, G. Jung, H. Yoo, and C. Lee. 2011. Advanced Coreless Flip-Chip BGA Package With High Dielectric Constant Thin Film Embedded Decoupling Capacitor. In IEEE 61st Electronic and Components Technology Conference, Lake Buena Vista, FL, May 31–June 3, 2011, 595–600.
Nickerson, R., R. Olmedo, R. Mortensen, C. Chee, S. Goyal, A. Low, and C. Gealer. 2012. Application of Coreless Substrate to Package on Package Architectures. In IEEE 62nd Electronic and Components Technology Conference, San Diego, CA, May 29–June 1, 2012, 1368–1371.
Kim, G., J. Yu, C. Park, S. Hong, J. Kim, G. Rinne, and C. Lee. 2012. Evaluation and Verification of Enhanced Electrical Performance of Advanced Coreless Flip-Chip BGA Package With Warpage Measurement Data. In IEEE 62nd Electronic and Components Technology Conference, San Diego, CA, May 29–June 1, 2012, 897–903.
Nishitani, Y. 2012. Coreless Packaging Technology for High-Performance Application. In IEEE/ECT/CMPT Seminar on Advanced Coreless Package Substrate and Material Technologies, Electronic Components and Technology Conference, San Diego, CA, May 29–June 1, 2012.
Kurashina, M., D. Mizutani, M. Koide, M. Watanabe, K. Fukuzono, and H. Suzuki. 2012. Low Warpage Coreless Substrate for Large-Size LSI Packages. In IEEE 62nd Electronic and Components Technology Conference, San Diego, CA, May 29–June 1, 2012, 1378–1383.
Kurashina, M., D. Mizutani, M. Koide, M. Watanabe, K. Fukuzono, N. Itoh, and H. Suzuki. 2012. Low Warpage Coreless Substrate for IC Packages. Transaction of the Japan Institute of Electronics Packaging 5 (1): 55–62.
Manusharow, M., S. Muthukumar, E. Zheng, A. Sadiq, and C. Lee. 2012. Coreless Substrate Technology Investigation for Ultra-Thin CPU BGA Packaging. In IEEE 62nd Electronic and Components Technology Conference, San Diego, CA, May 29–June 1, 2012, 892–896.
Kim, J., S. Lee, J. Lee, S. Jung, and C. Ryu. 2012. Warpage Issues and Assembly Challenges Using Coreless Package Substrate. In IPC APEX Expo, San Diego, CA, February 28–March 1, 2012.
Sakuma, K., E. Blackshear, K. Tunga, C. Lian, S. Li, M. Interrante, O. Mantilla, and J. Nah. 2013. Flip Chip Assembly Method Employing Differential Heating/Cooling for Large Dies With Coreless Substrates. In IEEE 63rd Electronic and Components Technology Conference, Las Vegas, NV, May 28–31, 2013, 667–673.
Hahm, Y., M. Li, J. Yan, Y. Tretiakov, H. Lan, S. Chen, and S. Wong. 2016. Analysis and Measurement of Power Integrity and Jitter Impacts on Thin-Core and Coreless Packages. In IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31–June 3, 2016, 387–392.
Baloglu, B., W. Lin, K. Stratton, M. Jimarez, and D. Brady. 2013. Warpage Characterization and Improvements for IC Packages With Coreless Substrate. In 46th International Symposium on Microelectronics, Orlando, FL, September 30–October 3, 2013, 260–284.
Sun, Y., X. He, Z. Yu, and L. Wan. 2013. Development of Ultra-Thin Low Warpage Coreless Substrate. In IEEE 63rd Electronic and Components Technology Conference, Las Vegas, NV, May 28–31, 2013, 1846–1849.
Lin, W., B. Baloglu, and K. Stratton. 2014. Coreless Substrate With Asymmetric Design to Improve Package Warpage. In IEEE 64th Electronic and Components Technology Conference, Orlando, FL, May 27–30, 2014, 1401–1406.
Liu, W., G. Xiaa, T. Liang, T. Li, X. Wang, J. Xie, S. Chen, and D. Yu. 2015. Development of High Yield, Reliable Fine Pitch Flip Chip Interconnects With Copper Pillar Bumps and Thin Coreless Substrate. In IEEE 65th Electronic and Components Technology Conference, San Diego, CA, May 26–29, 2015, 1713–1717.
Pendse, R., K. Kim, O. Kim, and K. Lee. 2006. Bond-On-Lead: A Novel Flip Chip Interconnection Technology for Fine Effective Pitch and High I/O Density. In IEEE 56th Electronic and Components Technology Conference, San Diego, CA, May 30–June 2, 2006, 16–23.
Pendse, R. 2008. Bump-On-Lead Flip Chip Interconnection. U.S. Patent No. 7,368,817, filed Nov. 10, 2004 and issued May 6, 2008.
Ouyang, E., M. Chae, S. Chow, R. Emigh, M. Joshi, R. Martin, and R. Pendse. 2010. Improvement of ELK Reliability in Flip Chip Packages Using Bond-On-Lead (BOL) Interconnect Structure. In IMAPS 43rd International Symposium on Microelectronics, Raleigh, NC, October 31–November 4, 2010, 197–203.
Pendse, R. 2011. Bump-On-Lead Flip Chip Interconnection. U.S. Patent No. 7,901,983, filed May 26, 2009 and issued March 8, 2011.
Pendse, R., C. Cho, M. Joshi, K. Kim, P. Kim, S. Kim, S. Kim, H. Lee, K. Lee, R. Martin, A. Murphy, V. Pandey, and C. Palar. 2010. Low CostmFlip Chip (LCFC): An Innovative Approach for Breakthrough Reduction in Flip Chip Package Cost. In IEEE 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1–4, 2010.
Movva, S., S. Bezuk, O. Bchir, M. Shah, M. Joshi, R. Pendse, E. Ouyang, Y. Kim, S. Park, H. Lee, S. Kim, H. Bae, G. Na, and K. Lee. 2011. CuBOL (Cu-Column on BOL) Technology: A Low Cost Flip Chip Solution Scalable to High I/O Density, Fine Bump Pitch and Advanced Si-Nodes. In IEEE 61st Electronic and Components Technology Conference, Lake Buena Vista, FL, May 31–June 3, 2011, 601–607.
Lan, A., C. Hsiao, J.H. Lau, E. So, and B. Ma. 2012. Cu Pillar Exposed-Die Molded FCCSP for Mobile Devices. In IEEE 62nd Electronic and Components Technology Conference, San Diego, CA, May 29–June 1, 2012, 886–891.
Kuo, F., J. Lee, F. Chien, R. Lee, C. Mao, and J.H. Lau. 2014. Electromigration Performance of Cu Pillar Bump for Flip Chip Packaging With Bump on Trace by Using Thermal Compression Bonding. In IEEE 64th Electronic and Components Technology Conference, Orlando, FL, May 27–30, 2014, 56–61.
Li, M., D. Tian, Y. Cheung, L. Yang, and J.H. Lau. 2015. A High Throughput and Reliable Thermal Compression Bonding Process for Advanced Interconnections. In IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26–29, 2015, 603–608.
Liu, F., C. Nair, V. Sundaram, and R. Tummala. 2015. Advances in Embedded Traces for 1.5 lm RDL on 2.5D Glass Interposers. In IEEE 65th Electronic and Components Technology Conference, San Diego, CA, May 26–29, 2015, 1736–1741.
Chen, C., M. Lin, G. Liao, Y. Ding, and W. Cheng. 2015. Balanced Embedded Trace Substrate Design for Warpage Control. In IEEE 65th Electronic and Components Technology Conference, San Diego, CA, May 26–29, 2015, 193–199.
Zhang, L., and G. Joseph. 2015. Low Cost High Performance Bare Die PoP With Embedded Trace Coreless Technology and ‘Coreless Cored’ Build UpSubstrate Manufacture Process. In IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26–29, 2015, 882–887.
Lu, M. 2014. Challenges and Opportunities in Advanced IC Packaging. Chip Scale Review 18 (2): 5–8.
Lee, K., S. Cha, and P. Shim. 2016. Form Factor and Cost Driven Advanced Package Substrates for Mobile and IoT Applications. In China Semiconductor Technology International Conference, Shanghai, China, March 13–14, 2016.
Chen, K., S. Lee, P. Andry, C. Tsang, A. Topop, Y. Lin, Y.J. Lu, A. Young, M. Ieong, and W. Haensch. 2006. Structure, Design, and Process Control for Cu Bonded Interconnects in 3D Integrated Circuits. In IEEE International Electron Devices Meeting, San Francisco, CA, December 11–13, 2006, 367–370.
Liu, F., R. Yu, A. Young, J. Doyle, X. Wang, L. Shi, K. Chen, X. Li, D. Dipaola, D. Brown, C. Ryan, J. Hagan, K. Wong, M. Lu, X. Gu, N. Klymko, E. Perfecto, A. Merryman, K. Kelly, S. Purushothaman, S. Koester, R. Wisnieff, and W. Haensch. 2008. A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through-Silicon Via and Hybrid Cu-Adhesive Bonding. In IEEE International Electron Devices Meeting, San Francisco, CA, December 15–17, 2008.
Yu, R., F. Liu, R. Polastre, K. Chen, X. Liu, L. Shi, E. Perfecto, N. Klymko, M. Chace, T. Shaw, D. Dimilia, E. Kinser, A. Young, S. Purushothaman, S. Koester, and W. Haensch. 2009. Reliability of a 300-mm-Compatible 3DI Technology Based on Hybrid Cu-Adhesive Wafer Bonding. In Symposium on VLSI Technology, Honolulu, HI, June 16–18, 2009, 170–171.
Shigetou, A., T. Itoh, K. Sawada, and T. Suga. 2008. Bumpless Interconnect of 6-lm Pitch Cu Electrodes at Room Temperature. In Electronic Components and Technology Conference, Lake Buena Vista, FL, May 27–30, 2008, 1405–1409.
Tsukamoto, K., E. Higurashi, and T. Suga. 2010. Evaluation of Surface Microroughness for Surface Activated Bonding. In IEEE CPMT Symposium Japan, Tokyo, Japan, August 24–26, 2010, 1–4.
Kondou, R., C. Wang, and T. Suga. 2010. Room-Temperature Si-Si and Si-SiN Wafer Bonding. In IEEE CPMT Symposium Japan, Tokyo, Japan, August 24–26, 2010, 161–164.
Shigetou, A., T. Itoh, M. Matsuo, N. Hayasaka, K. Okumura, and T. Suga. 2006. Bumpless Interconnect Through Ultrafine Cu Electrodes by Means of Surface-Activated Bonding (SAB) Method. IEEE Transactions on Advanced Packaging 29 (2): 218–226.
Wang, C., and T. Suga. 2009. A Novel Moir_e Fringe Assisted Method for Nanoprecision Alignment in Wafer Bonding. In IEEE 59th Electronic Components and Technology Conference, San Diego, CA, May 26–29, 2009, 872–878.
Wang, C., and T. Suga. 2009. Moir_e Method for Nanoprecision Wafer-To-Wafer Alignment: Theory, Simulation, and Application. In IEEE International Conference on Electronic Packaging Technology and High-Density Packaging, Beijing, China, August 10–13, 2009, 219–224.
Higurashi, E., D. Chino, T. Suga, and R. Sawada. 2009. Au-Au Surface-Activated Bonding and Its Application to Optical Microsensors With 3-D Structure. IEEE Journal of Selected Topics in Quantum Electronics 15 (5): 1500–1505.
Eitan, A., and K. Jing. 2015. Thermo-Compression Bonding for Fine-Pitch Copper-Pillar Flip Chip Interconnect—Tool Features as Enablers of Unique Technology. In IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26–29, 2015, 460–464.
Lau, J.H., and C. Chang. 2002. Characteristics and Reliability of Fast-Flow, Snap-Cure, and Reworkable Underfills for Solder Bumped Flip Chip on Low-Cost Substrates. IEEE Transactions on Electronics Packaging Manufacturing 25 (3): 231–230.
Lau, J.H., and R. Lee. 2000. Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills. ASME Journal of Electronic Packaging 222 (4): 306–310.
Lau, J.H., R. Lee, and C. Chang. 2000. Effects of Underfill Material Properties on the Reliability of Solder Bumped Flip Chip on Board With Imperfect Underfill Encapsulants. IEEE Transactions on CPMT 23 (2): 323–333.
Lau, J.H., and S.W. Lee. 2000. Effects of Underfill Delamination and Chip Size on the Reliability of Solder Bumped Flip Chip on Board. IMAPS Transactions on International Journal of Microcircuits and Electronic Packaging 23 (1): 33–39.
Lau, J.H., C. Chang, and C. Chen. 1999. Characteristics and Reliability of No-Flow Underfills for Solder Bumped Flip Chip Assemblies. IMAPS Transactions on International Journal of Microcircuits and Electronic Packaging 22 (4): 370–381.
Lau, J.H., and C. Chang. 1999. How to Select Underfill Materials for Solder Bumped Flip Chips on Low Cost Substrates? IMAPS Transactions on International Journal of Microelectronics and Electronic Packaging 22 (1): 20–28.
Lau, J.H., and C. Chang. 1999. Characterization of Underfill Materials for Functional Solder Bumped Flip Chips on Board Applications. IEEE Transactions on CPMT, Part A 22 (1): 111–119.
Lau, J.H., C. Chang, and C. Ouyang. 1998. SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates. Journal of Electronics Manufacturing 8 (3–4): 151–164.
Lau, J.H., C. Chang, and R. Chen. 1997. Effects of Underfill Encapsulant on the Mechanical and Electrical Performance of a Functional Flip Chip Device. Journal of Electronics Manufacturing 7 (4): 269–277.
Lau, J.H., and B. Wun. 1995. Characterization and Evaluation of the Underfill Encapsulants for Flip Chip Assembly. Soldering and Surface Mount Technology 21 (1): 25–27.
Lau, J.H., E. Schneider, and T. Baker. 1996. Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards. ASME Journal of Electronic Packaging 118 (2): 101–104.
Lau, J.H. 1998. Flip Chip on PCBs With Anisotropic Conductive Film. Advanced Packaging, 44–48.
Lau, J.H., C. Chang, and R. Lee. 2000. Failure Analysis of Solder Bumped Flip Chip on Low-Cost Substrates. IEEE Transactions on Electronics Packaging Manufacturing 23 (1): 19–27.
Lau, J.H., R. Lee, S. Pan, and C. Chang. 2002. Nonlinear Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications. ASME Journal of Electronics Packaging 124 (3): 205–211.
Lau, J.H., Q. Zhang, M. Li, K. Yeung, Y. Cheung, N. Fan, Y. Wong, M. Zahn, and M. Koh. 2015. Stencil Printing of Underfill for Flip Chips on Organic-Panel and Si-Wafer Assemblies. In IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26–29, 2015, 168–174.
Nakano, F., T. Soga, and S. Amagi. 1987. Resin-Insertion Effect on Thermal Cycle Resistivity of Flip-Chip Mounted LSI Devices. In International Symposium on Microelectronics, Minneapolis, MN, September 28–30, 1987, 536–541.
Lau, J.H., T. Krulevitch, W. Schar, M. Heydinger, S. Erasmus, and J. Gleason. 1993. Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards. Circuit World 19 (3): 18–24.
Wun, B., and J.H. Lau. 1995. Characterization and Evaluation of the Underfill Encapsulants for Flip Chip Assembly. Circuit World 21 (3): 25–32.
Lai, Y.M., C.K. Chee, E. Then, C.H. Ng, and M.F. Low. 2007. Capillary Underfill and Mold Encapsulation Method and Apparatus. U.S. Patent No. 7,262,077, filed September 30, 2003 and issued August 28, 2007.
Cremaldi, J., M. Gaynes, P. Brofman, N. Pesika, and E. Lewandowski. 2014. Time, Temperature, and Mechanical Fatigue Dependence on Underfill Adhesion. In IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27–30, 2014, 255–262.
Gilleo, K., B. Cotterman, and I.A. Chen. 2000. Molded Underfill for Flip Chip in Package. In Proceedings of High Density Interconnects, 2000, 28–31.
Rector, L.P., S. Gong, T.R. Miles, and K. Gaffney. 2000. Transfer Molding Encapsulation of Flip Chip Array Packages. International Journal of Microcircuits and Electronic Packaging 23 (4): 401–406.
Lee, J.Y., K.S. Oh, C.H. Hwang, C.H. Lee, and R.D.S. Amand. 2009. Molded Underfill Development for FlipStack CSP. In IEEE 59th Electronic Components and Technology Conference, San Diego, CA, May 26–29, 2009, 954–959.
Joshi, M., R. Pendse, V. Pandey, T.K. Lee, I.S. Yoon, J.S. Yun, Y.C. Kim, and H.R. Lee. 2010. Molded Underfill (MUF) Technology for Flip Chip Packages in Mobile Applications. In IEEE 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1–4, 2010, 1250–1257.
Ferrandon, C., A. Jouve, S. Joblot, Y. Lamy, A. Schreiner, P. Montmeat, M. Pellat, M. Argoud, F. Fournel, G. Simon, and S. Cheramy. 2013. Innovative Wafer-Level Encapsulation and Underfill Material for Silicon Interposer Application. In IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28–31, 2013, 761–767.
Degani, Y., and L.A. Greenberg. 2002. Integrated circuit bonding method. European Patent 0 805 486 B1, February 6, 2002.
Lau, J.H., Q. Zhang, M. Li, K. Yeung, Y. Cheung, N. Fan, Y. Wong, M. Zahn, and M. Koh. 2015. Stencil Printing of Underfill for Flip Chips on Organic-Panel and Si-Wafer Substrates. IEEE Transactions on CPMT 5 (7): 1027–1035.
Wong, C.P., D. Baldwin, M.B. Vincent, B. Fennell, L.J. Wang, and S.H. Shi. 1998. Characterization of a No-Flow Underfill Encapsulant During the Solder Reflow Process. In IEEE 48th Electronic Components and Technology Conference, Seattle, WA, May 25–28, 1998, 1253–1259.
Lee, M., M. Yoo, J. Cho, S. Lee, J. Kim, C. Lee, D. Kang, C. Zwenger, and R. Lanzone. 2009. Study of Interconnection Process for Fine Pitch Flip Chip. In IEEE 48th Electronic Components and Technology Conference, Seattle, WA, May 25–28, 2009, 720–723.
Okayama, Y., M. Nakasato, K. Saitou, Y. Yanase, H. Kobayashi, T. Yamamoto, R. Usui, and Y. Inoue. 2010. Fine Pitch Connection and Thermal Stress Analysis of a Novel Wafer Level Packaging Technology Using Laminating Process. In IEEE 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1–4, 2010, 287–292.
Honda, K., T. Enomoto, A. Nagai, and N. Takano. 2010. NCF for Wafer Lamination Process in Higher Density Electronic Packages. In IEEE 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1–4, 2010, 1853–1860.
Honda, K., A. Nagai, M. Satou, S. Hagiwara, S. Tuchida, and H. Abe. 2012. NCF for Pre-Applied Process in Higher Density Electronic Package Including 3D-Package. In IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29–June 1, 2012, 385–392.
Fukushima, T., Y. Ohara, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi. 2012. Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration. In IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29–June 1, 2012, 385–392.
Ito, Y., M. Murugesan, H. Kino, T. Fukushima, K. Lee, K. Choki, T. Tanaka, and M. Koyanagi. 2015. Development of Highly-Reliable Microbump Bonding Technology Using Self-Assembly of NCF-Covered KGDs and Multi-Layer 3D Stacking Challenges. In IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26–29, 2015, 336–341.
Choubey, A., E. Anzures, D. Fleming, A. Dhoble, L. Herong, R. Barr, J. Calvert, and J. Oh. 2014. Non-Conductive Film (NCF) Underfill for Flip Chip Assembly and High Reliability. In International Wafer Level Packaging Conference, San Jose, CA, November 11–13, 2014.
Lee, D., K. Kim, K. Kim, H. Kim, J. Kim, Y. Park, J. Kim, D. Kim, H. Park, J. Shin, J. Cho, K. Kwon, M. Kim, J. Lee, K. Park, B. Chung, and S. Hong. 2014. A 1.2 V 8 Gb 8-Channel 128 GB/s High-Bandwidth Memory (HBM) Stacked DRAM With Effective Microbump I/O Test Methods Using 29 nm Process and TSV. In IEEE International Solid-State Circuits Conference Digest of Technical Papers, San Francisco, CA, February 9–13, 2014, 433–435.
Shin, J., Y. Kim, H. Lee, U. Kang, S. Seo, and K. Paik. 2015. Effects of Thermo-Compression Bonding Parameters on Joint Formation of Micro-Bumps in Non-Conductive Film (NCF). In IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26–29, 2015, 910–915.
Lee, H., Y. Choi, J. Shin, and K. Paik. 2015. Wafer Level Packages (WLPs) Using B-Stage Non-Conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-Bump Interconnection. In IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26–29, 2015, 331–335.
Hiner, D., D. Kim, S. Ahn, K. Kim, H. Kim, M. Lee, D. Kang, M. Kelly, R. Huemoeller, R. Radojcic, and S. Gu. 2015. Multi-Die Chip on Wafer Thermo-Compression Bonding Using Non-Conductive Film. In IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26–29, 2015, 17–21.
Nonaka, T., Y. Kobayashi, N. Asahi, S. Niizeki, and K. Fujimaru. 2014. High Throughput Thermal Compression NCF Bonding. In IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27–30, 2014, 913–918.
Matsumura, K., M. Tomikawa, Y. Sakabe, and Y. Shiba. 2015. New Non Conductive Film for High Productivity Process. In IEEE CPMT Symposium Japan, Kyoto, Japan, November 9–11, 2015, 19–20.
Asahi, N., Y. Miyamoto, M. Nimura, Y. Mizutani, and Y. Arai. 2015. High Productivity Thermal Compression Bonding for 3D-IC. In IEEE International 3D Systems Integration Conference, Sendai, Japan, August 31–September 2, 2015, TS7.3.1–TS7.3.5.
Kagawa, Y., N. Fujii, K. Aoyagi, Y. Kobayashi, S. Nishi, N. Todaka, et al. 2016. Novel Stacked CMOS Image Sensor With Advanced Cu2Cu Hybrid Bonding. In IEEE/IEDM Proceedings, December 2016, 8.4.1–4.
Sukegawa, S., T. Umebayashi, T. Nakajima, H. Kawanobe, K. Koseki, I. Hirota, et al. 2013. A 1/4-inch 8Mpixel back-illuminated stacked CMOS image sensor. In Proceedings of IEEE/ISSCC, San Francisco, CA, February 2013, 484–484.
Tseng, C., C. Liu, C. Wu, and D. Yu. 2016. InFO (Wafer Level Integrated Fan-Out) Technology. In IEEE/ECTC Proceedings, May 2016, 1–6.
Lau, J.H. 2016. Recent Advances and New Trends in Flip Chip Technology. ASME Transactions, Journal of Electronic Packaging 138(3):1–23.
Lau, J.H. 2017. Status and Outlooks of Flip Chip Technology. In IPC EXPO Proceedings, February 2017, 1–20.
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Lau, J.H. (2018). Flip Chip Technology Versus FOWLP. In: Fan-Out Wafer-Level Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-10-8884-1_2
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