Abstract
The thin film materials with small volume and high reliability have become an integral part of microelectromechanical systems and have a wide range of applications in national defense, aerospace, communication, automobile manufacturing, and other fields. The service reliability and service life are determined by the mechanical properties of thin film materials.
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Wang, H., Zhu, L., Xu, B. (2018). Application of Suresh and Lee Models in the Measurement of Residual Stress of Films. In: Residual Stresses and Nanoindentation Testing of Films and Coatings. Springer, Singapore. https://doi.org/10.1007/978-981-10-7841-5_6
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DOI: https://doi.org/10.1007/978-981-10-7841-5_6
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Online ISBN: 978-981-10-7841-5
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