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Modeling and Simulation for Defect Depth Estimation Using Pulsed Eddy Current Technique

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Modeling, Design and Simulation of Systems (AsiaSim 2017)

Part of the book series: Communications in Computer and Information Science ((CCIS,volume 752))

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Abstract

A finite element simulation for defect depth estimation using the pulsed eddy current (PEC) technique is presented in this paper. In this work, we investigate PEC inspection on defect with different depths, through the transient magnetic flux density profile from eddy current and defect interaction in a stainless steel sample. The investigation is implemented via time-stepping finite element method (FEM) modelled in 3D using COMSOL. The estimation of defect depth was made possible by the peak amplitude feature of the differential magnetic flux density profile acquired by the PEC coil. The underlying phenomena of the acquired results is then observed and discussed through the visualisation of the resultant eddy current density for different defect depths obtained from the simulation. The simulation results indicate the potential of detection and quantitative evaluation of defect using the PEC technique. It is expected the investigation will help in the future work of PEC in terms of sensor development and inversion models for defect characterisation.

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Acknowledgement

The authors would like to thank the Malaysian Nuclear Agency especially the staff of Leading Edge NDT Technology (LENDT) Group for their support of this work.

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Correspondence to Muhammad Zamir Kamaruzzaman .

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© 2017 Springer Nature Singapore Pte Ltd.

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Kamaruzzaman, M.Z., Zainal Abidin, I.M., Hamzah, A.R. (2017). Modeling and Simulation for Defect Depth Estimation Using Pulsed Eddy Current Technique. In: Mohamed Ali, M., Wahid, H., Mohd Subha, N., Sahlan, S., Md. Yunus, M., Wahap, A. (eds) Modeling, Design and Simulation of Systems. AsiaSim 2017. Communications in Computer and Information Science, vol 752. Springer, Singapore. https://doi.org/10.1007/978-981-10-6502-6_16

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  • DOI: https://doi.org/10.1007/978-981-10-6502-6_16

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-10-6501-9

  • Online ISBN: 978-981-10-6502-6

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