Abstract
This chapter focuses on the study of micro-galvanic corrosion of the Cu/Ru couple in KIO4 solution. Practical nobility across the Cu/Ru interface was evaluated by Volta potential mapping, and the morphological changes were monitored by in situ atomic force microscopy measurement during exposure in a KIO4 solution. Chemical composition of precipitated corrosion products was analyzed by confocal Raman spectroscopy immediately after the exposure. The results show that Cu is the anode of the Cu/Ru couple, and accelerated dissolution of Cu preferentially occurs near the Cu/Ru interface. However, subsequent formation of insoluble Cu(IO3)2·nH2O leads to precipitation, which impedes further Cu corrosion. On this basis, the generating and development of Cu/Ru galvanic corrosion have been fully revealed.
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Cheng, J. (2018). Micro-galvanic Corrosion of Cu/Ru Couple in KIO4 Solution. In: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect . Springer Theses. Springer, Singapore. https://doi.org/10.1007/978-981-10-6165-3_5
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DOI: https://doi.org/10.1007/978-981-10-6165-3_5
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