Fatigue Life Estimation of Components Mounted on PCB Due to Vibration
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A spacecraft consists of a number of electronic packages to meet the functional requirements. An electronic package is generally an assembly of printed circuit boards placed in a mechanical housing. A number of electronic components are mounted on the printed circuit board (PCB). A spacecraft experiences various types of loads during its launch such as vibration, acoustic and shock loads. Prediction of response for printed circuit boards due to vibration loads is important for mechanical design and reliability of electronic packages. Dynamic analysis of printed circuit boards is carried out using finite element method. The components mounted on PCB experience stresses due to curvature of the board and inertia loads. The response of the component depends on its natural frequency as well as PCB dynamic characteristics. The objective of this paper is to predict the fatigue life of components mounted on printed circuit boards due to vibration. A case study of a typical component mounted on PCB is taken up and dynamic analysis is carried out for base excitation. Modal analysis and frequency response analysis are carried out using FEM. The component lead stresses due to vibration are determined. The fatigue life is estimated for sine and random vibration environment.
KeywordsPrinted circuit board (PCB) Spacecraft Vibration analysis Component stress Fatigue life
The authors would like to thank Mr. Anand, M. Tech Project student at ISAC for his help in FEM simulations.
- 1.Steinberg DS (2000) Vibration analysis for electronic equipment, 3rd edn. Wiley, New YorkGoogle Scholar
- 2.Suhir E (2000) Predicted fundamental vibration frequency of a heavy electronic component mounted on a printed circuit board. J Electron Packag 122(1):3–5Google Scholar
- 3.Schaller A (1988) Finite element analysis of microelectronic component-state of the art. In: CH2629-4/88/0000-0057 @1988 IEEE conferenceGoogle Scholar
- 4.Silva GHC, Gonçalves PJP (2013) A model for computing vibration induced stresses of electronic components in a general flexible mounting. J Sound Vib 332:5192–5206Google Scholar
- 5.Jung IH, Park TW, Han SW, Seo JH, Kim SH (2004) Structural vibration analysis of electronic equipment for satellite under launch environment. J Korean Soc Precis Eng 21(8):1440–1445Google Scholar
- 6.Pitarresi JM (1990) Modeling of printed circuit cards subject to vibration. Department of Mechanical and Industrial Engineering, State University of New York at Binghamton, Binghamton, New York 13901, pp 2104–2107Google Scholar
- 7.Liguore S, Followell D (1995) Vibration fatigue of surface mount technology (SMT) solder joints. In: Proceedings annual reliability and maintainability symposium, pp 18–26Google Scholar