Abstract
In this paper, fabrication, characterization, and analysis of a FGMOS gate stack employing ultra-thin tunnel oxide of 3 nm thickness are discussed. Apart from basic C-V and G-V profiles, high-frequency hysteresis curve has been investigated and device-level parameters are extracted. Use of ultra-thin tunnel oxide has facilitated direct tunneling mechanism at program/erase voltages of 10 V for 200 ms and −8 V for 40 ms, respectively. Excellent memory window of 1.2 V has been obtained. Frequency-dependent capacitance and reliability-related profiles are also studied. The device is useful for power-efficient non-real-time applications like data logging, biometric security, backup servers.
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This device was fabricated and characterized at IIT Bombay Nano-Fabrication Centre (IITB-NF), Mumbai, India.
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Dhavse, R., Prashant, K., Dabhi, C., Darji, A., Patrikar, R.M. (2018). Fabrication and Investigation of Low-Voltage Programmable Flash Memory Gate Stack. In: Nath, V. (eds) Proceedings of the International Conference on Microelectronics, Computing & Communication Systems. Lecture Notes in Electrical Engineering, vol 453. Springer, Singapore. https://doi.org/10.1007/978-981-10-5565-2_4
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