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Investigation of Titanium Aluminium Nitride (TiAlN): A Review

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Book cover Advances in Electronics, Communication and Computing

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 443))

Abstract

Titanium aluminium nitride (TiAlN) thin films are now commonly used as protective layer in various fields as these films have high thermal stability and sound corrosion resistance. Due to high hardness and wear resistance at elevated temperature, it is one of the most important thin film coating material for cutting tools. Various deposition methods such as physical vapour deposition (PVD), chemical vapour deposition (CVD), sputtering technique, etc., are used by many researchers to synthesize TiAlN coatings. To analyse morphological, structural, and mechanical characteristics, various tests such as SEM, AFM, xrd, Raman, and nanoindentation have been carried out by many researchers. This paper basically summarizes the properties of TiAlN monolayer, nanolayer, and multilayer thin films.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Sikkim Manipal Institute of Technology, Majitar, Sikkim, India

    Soham Das

  2. Centre for Material Science and Nano Technology, Sikkim Manipal Institute of Technology, Majitar, Sikkim, India

    Bibhu Prasad Swain

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  1. Soham Das
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  2. Bibhu Prasad Swain
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Correspondence to Soham Das .

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Editors and Affiliations

  1. Smart Energy Research Unit, College of Engineering and Science, Victoria University, Melbourne, VIC, Australia

    Akhtar Kalam

  2. Electronics and Communication Sciences Unit, Indian Statistical Institute, Kolkata, West Bengal, India

    Swagatam Das

  3. Department of Computer Science and Engineering, Sikkim Manipal Institute of Technology, Rangpo, Sikkim, India

    Kalpana Sharma

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Das, S., Swain, B.P. (2018). Investigation of Titanium Aluminium Nitride (TiAlN): A Review. In: Kalam, A., Das, S., Sharma, K. (eds) Advances in Electronics, Communication and Computing. Lecture Notes in Electrical Engineering, vol 443. Springer, Singapore. https://doi.org/10.1007/978-981-10-4765-7_16

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  • DOI: https://doi.org/10.1007/978-981-10-4765-7_16

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  • Online ISBN: 978-981-10-4765-7

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