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Wiring the Tin–Silver–Copper Alloy by Fused Deposition Modeling

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Innovative Design and Development Practices in Aerospace and Automotive Engineering

Part of the book series: Lecture Notes in Mechanical Engineering ((LNME))

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Abstract

This paper aims at investigating the feasibility of extrusion and molding a low-melting point metal, Sn–Ag–Cu alloy, on a substrate by fused deposition modeling (FDM). Two Sn–Ag–Cu alloys, one is eutectic Sn–3.0Ag–0.5Cu (SAC305) and another non-eutectic Sn–0.3Ag–0.7Cu (SAC307), are studied for their molding resolutions, material compositions, tensile strength, tear strength, and sheet resistivities after FDM process. The FDM system is assembled by the authors. The molding resolutions are measured by caliper and micrometer. The material compositions are analyzed by energy dispersive spectrometer (EDS). The tensile strengths and tear strengths are measured by Lloyd-LS1 tensile tester. The sheet resistivities are measured by four-point probe station. Some conclusions are drawn according to the experiments. For better resolution, the extrusion temperature is a little higher than the melting point of the material. The FDM process significantly reduces the tensile strength of the materials. For the tear strength, SAC305 is better than SAC0307. The higher the extrusion temperature is, the higher the sheet resistivity is.

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Acknowledgments

This work was supported by the Ministry of Science and Technology, Taiwan with the contact number: MOST 103-2221-E-197-015-MY2.

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Authors and Affiliations

  1. Department of Mechanical and Electromechanical Engineering, National ILan University, 1, Sec. 1, Shennong Road, Yilan, 26041, Taiwan

    Yuh-Chung Hu, Yi-Ta Wang & Hsiu-Hsien Wu

Authors
  1. Yuh-Chung Hu
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  2. Yi-Ta Wang
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  3. Hsiu-Hsien Wu
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Corresponding author

Correspondence to Yuh-Chung Hu .

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Editors and Affiliations

  1. Vel Tech Rangarajan Dr. Sagunthala R&D Institute of Science and Technology, Chennai, Tamil Nadu, India

    Ram P. Bajpai

  2. Vel Tech Rangarajan Dr. Sagunthala R&D Institute of Science and Technology, Chennai, Tamil Nadu, India

    U. Chandrasekhar

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Hu, YC., Wang, YT., Wu, HH. (2017). Wiring the Tin–Silver–Copper Alloy by Fused Deposition Modeling. In: Bajpai, R.P., Chandrasekhar, U. (eds) Innovative Design and Development Practices in Aerospace and Automotive Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-10-1771-1_9

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  • DOI: https://doi.org/10.1007/978-981-10-1771-1_9

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-10-1770-4

  • Online ISBN: 978-981-10-1771-1

  • eBook Packages: EngineeringEngineering (R0)

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