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Dynamic TDMA for Networked Embedded Systems

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Information Science and Applications (ICISA) 2016

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 376))

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Abstract

We present a dynamic Time Division Multiple Access (TDMA) protocol for predictable communication in Networked Embedded Systems. The nodes in such systems are typically resource constrained and can communicate over low power, low bandwidth wireless links. Several TDMA protocols have been reported in the literature for similar nodes. The approach we present offers dynamic reconfiguration of the flows between nodes in the system. Our protocol uses dynamic time slots that will be assigned online to the nodes as needed. In our current architecture, a centralized coordinator directs the flow among the nodes by reconfiguring the local TDMA schedules. In the future, this protocol can be extended to fully enable reconfigurable flows in Networked Embedded Systems using a collection of decentralized controllers.

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Author information

Authors and Affiliations

  1. Department of Electrical and Computer Engineering, The University of Akron, Akron, OH, 44325-3904, USA

    Mukesh K. Chippa, Mohamed A. Elamin, Shivakumar Sastry & Nghi H. Tran

Authors
  1. Mukesh K. Chippa
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  2. Mohamed A. Elamin
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  3. Shivakumar Sastry
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  4. Nghi H. Tran
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Corresponding author

Correspondence to Mukesh K. Chippa .

Editor information

Editors and Affiliations

  1. Kyonggi University, iCatse Kyonggi University, Seongnam-si, Kyonggi-do, Korea (Republic of)

    Kuinam J. Kim

  2. Chair of IEEE CS STCOS, IBM T.J.Watson Research Center Chair of IEEE CS STCOS, Yorktown Heights, New York, USA

    Nikolai Joukov

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© 2016 Springer Science+Business Media Singapore

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Chippa, M.K., Elamin, M.A., Sastry, S., Tran, N.H. (2016). Dynamic TDMA for Networked Embedded Systems. In: Kim, K., Joukov, N. (eds) Information Science and Applications (ICISA) 2016. Lecture Notes in Electrical Engineering, vol 376. Springer, Singapore. https://doi.org/10.1007/978-981-10-0557-2_26

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  • DOI: https://doi.org/10.1007/978-981-10-0557-2_26

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-10-0556-5

  • Online ISBN: 978-981-10-0557-2

  • eBook Packages: EngineeringEngineering (R0)

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