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Usage of a Digital Eco-factory for a Printed Circuit Assembly Line

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Sustainability Through Innovation in Product Life Cycle Design

Part of the book series: EcoProduction ((ECOPROD))

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Abstract

A concept called digital eco-factory (a collection of software agents that virtually represent the hardware and software facilities involved in a manufacturing system) has been developed to examine the environmental performance, productivity, and manufacturability, simultaneously, of a manufacturing system. This study reports three applications of the digital eco-factory in evaluating a printed circuit assembly (PCA) line. The first application deals with the determination of environmental performance and productivity of a PCA line for various production plans without changing the configuration of the line. The second application deals with the evaluation of the adequacy of the production plans for various PCA lines. The last application deals with the effects of an accident (e.g., machine failures) while running a PCA line. The successful implementation of the proposed digital eco-factory in the above three cases helps identify the general configuration of the digital eco-factory that can be used for other production lines.

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Acknowledgments

This work is supported by JKA and its promotion funds from KEIRIN RACE. The authors thank members of Technical Committee “DEcoF (Digital Eco-factory) (Oct.2012–) by FAOP (FA Open Systems Promotion Forum) in MSTC (Manufacturing Science and Technology Center), Japan, for fruitful discussions and their supports [12]. The authors are grateful to Dr. Udo Graefe, retired from the National Research Council of Canada for his helpful assistance with the writing of this paper in English.

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Correspondence to Yasuhiro Sudo .

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Sudo, Y., Matsuda, M., Kimura, F. (2017). Usage of a Digital Eco-factory for a Printed Circuit Assembly Line. In: Matsumoto, M., Masui, K., Fukushige, S., Kondoh, S. (eds) Sustainability Through Innovation in Product Life Cycle Design. EcoProduction. Springer, Singapore. https://doi.org/10.1007/978-981-10-0471-1_28

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