Abstract
Silicones are synthetic polymers based on a molecular structure of alternating silicon and oxygen atoms with organic groups also attached to all or some of the silicon atoms. Their general formula is [R a SiO(4−a)/2] b where a = 1 to 3 and b≥2. R represents an organic group.
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References
Kipping, F. S. and Lloyd, L. L., Organic derivatives of silicon, J. Chem. Soc., 79, 449 (1901).
Alperowicz, N., Dow Corning poised for growth in Europe, Chemical Week, April 3, 1996.
Eaborn, C., Organosilicon Compounds, Butterworth Scientific Publications, London, 1960.
Noll, W., Chemie and Technologie der Silicone, Verlag Chemie, Weinheim, 1960.
Von Hippel, A., Dielectric Materials and Applications, Technology Press of MIT and John Wiley Sons Inc., New York, 1954.
Joint Assessment of Commodity Chemicals No. 26: Linear Polydimethylsiloxanes, ECETOC Brussels, September 1994.
Hilado, C. J., Casey, C. J., Christensen, D. F. and Lipowitz, J., Toxicity of pyrolysis gases from silicone polymers, J. Combustion Toxicology, 5, 130–140, May 1978.
Lynch, W., Handbook of Silicone Rubber Fabrication, Van Nostrand Rheinhold Co., New York, 1978.
France, P. W., Dunn, P. L. and Reeve, M. H., Plastic coating of glass fibres and its influence on strength, Fibre and Integrated Optics, 2, (1979).
Mollie, J.-P., and Paquet, R., Performance of new silicone adhesives and encapsulants at high and low temperature, Proc. IEE Automotive Eighth International Conference, London, 1988.
Kookootsedes, G., and Antonen, R., Selecting protective materials for coating hybrid circuits, Hybrid Circuit Technology, March 1986.
Day, A. G., and Weller, M.G., Flammability testing of printed wiring board material and the effect of the conformal coating, Proc. Internepcon Conference, Brighton, 1980.
Mollie, J.-P., Klebstoffe aus Silicon, Electronik Produktion Pruftechnik, March 1995.
Vanwert, B., One-part thermal cure silicone adhesives, Proc. NEPCON WEST ‘86, California, 1996.
Wilson, S., Thermally conductive adhesives for high thermally stressed assembly, Proc. NEPCON WEST ‘86, California, 1996.
Verhelst, V., Capillary zone electrophoresis determination of ionic impurities in silicone product used for electronic applications, J. Chromatography, Special Issue, International Symposium, Reading, 1996.
Otsuka, K. et al.,The mechanisms that provide corrosion protection for silicone gel encapsulated chips. IEEE Transactions on Components, Hybrids,CHMT-12 (4), December 1987.
Ahlburn, B. T. et al.,Hydrogen silsesquioxane-based flowable oxide as an element in the inter-level dielectric for sub 0.5 micron ULSI circuits, Multilevel Interconnection Conference,Santa Clara, 1995.
Ballance, D. S., Scheibert, K. A. and Tietz, J. V., Low temperature reflow planarisation using a novel spin-on inter-level dielectric, Multilevel Interconnection Conference (VMIC), 1995.
Waeterloos, J. and Meynen, H., Integrating a hydrogen-silsesquioxane spin-on dielectric in a quarter-micron technology, DUMIC, California, February 1997.
Cush, R.J., LSR: the versatile alternative, British Plastics and Rubber, 29–31 (October 1982).
Lipowitz, J., Combustion, Flammability and Fire Hazard Properties of Silicones, Publication NMAB-342, National Academy of Sciences, Washington, DC, 1978.
Weyenberg, D. R., and Lane, T. H., Future Directions for Silicon-based Polymers, American Chemical Society, 1990.
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© 1999 Springer Science+Business Media Dordrecht
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Mollie, JP. (1999). Silicone Materials for Electronic Components and Circuit Protection. In: Goosey, M. (eds) Plastics for Electronics. Springer, Dordrecht. https://doi.org/10.1007/978-94-017-2700-6_2
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DOI: https://doi.org/10.1007/978-94-017-2700-6_2
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