Abstract
During this decade, the competitiveness of the electronics industry has been determined by the following six aspects: cost reduction, miniaturization of devices, function integration, product reliability, design freedom and improved environmental compatibility.
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© 1999 Springer Science+Business Media Dordrecht
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Pöhlau, F., Feldmann, K. (1999). Moulded Interconnect Devices (MIDs). In: Goosey, M. (eds) Plastics for Electronics. Springer, Dordrecht. https://doi.org/10.1007/978-94-017-2700-6_11
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DOI: https://doi.org/10.1007/978-94-017-2700-6_11
Publisher Name: Springer, Dordrecht
Print ISBN: 978-90-481-4018-3
Online ISBN: 978-94-017-2700-6
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