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New Polymers for Emerging Interconnection Applications

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Plastics for Electronics

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Abstract

The principal drivers for the development of new polymers for electronic applications include:

  • device, substrate and system miniaturization impacting operational speed and product weight (e.g. portability),

  • coefficient of thermal expansion (CTE) mismatch of semiconductor and related packaging and interconnecting materials,

  • increase in data signal processing speeds and need for dielectric constant (ε′) and dielectric loss (ε″) reduction,

  • integration of low cost, production efficient, high performance materials and enabling technologies into consumer products,

  • improved product reliability.

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Author information

Authors and Affiliations

  1. Dow Deutschland Inc., Industriestraße 1, D-77836, Rheinmünster, Germany

    John Everett

  2. The Dow Chemical Co., c/o MCNC Research Triangle Park, NC, 27709, USA

    Philip Garrou

  3. The Dow Chemical Company, Midland, Michigan, MI, 48674, USA

    David Dalman

Authors
  1. John Everett
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  2. Philip Garrou
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  3. David Dalman
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Editor information

Editors and Affiliations

  1. Shipley Europe Ltd, Herald Way, Coventry, UK

    Martin Goosey (Chief Scientist and Technology Fellow) (Chief Scientist and Technology Fellow)

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© 1999 Springer Science+Business Media Dordrecht

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Everett, J., Garrou, P., Dalman, D. (1999). New Polymers for Emerging Interconnection Applications. In: Goosey, M. (eds) Plastics for Electronics. Springer, Dordrecht. https://doi.org/10.1007/978-94-017-2700-6_10

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  • DOI: https://doi.org/10.1007/978-94-017-2700-6_10

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-90-481-4018-3

  • Online ISBN: 978-94-017-2700-6

  • eBook Packages: Springer Book Archive

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