Abstract
The junction between Au and Al in a current-carrying contact for application to integrated circuits is considered. The conductivity of the compound is identified by means of a field-inversion technique.
The simulation of the growth process of the Au-Al compound relies on the transient field analysis of the current flow through the junction. Results of the identification are compared with measurements.
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© 2003 Springer Science+Business Media Dordrecht
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Bramanti, A., Di Barba, P., Savini, A., Tamburini, U.A., Maglia, F. (2003). Identification of Conductivity Distribution in a Au-Al Junction for Application to Integrated Circuits. In: Rudnicki, M., Wiak, S. (eds) Optimization and Inverse Problems in Electromagnetism. Springer, Dordrecht. https://doi.org/10.1007/978-94-017-2494-4_22
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DOI: https://doi.org/10.1007/978-94-017-2494-4_22
Publisher Name: Springer, Dordrecht
Print ISBN: 978-90-481-6375-5
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