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Creep—fatigue crack growth

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High Temperature Component Life Assessment

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Abstract

In this chapter the main factors influencing high temperature creep—fatigue crack growth in engineering materials are discussed. The significance of minimum to maximum load ratio R, frequency, environment and temperature are considered in turn. Transgranular cycle dependent and intergranular time dependent controlled cracking processes are identified. Conditions favouring each mechanism are clarified and it is shown that cumulative damage concepts can be applied to predict interaction effects. It is found that cyclic controlled processes are most likely to dominate at high frequencies and low R. Creep and environmental mechanisms, which are favoured at low frequencies, high temperatures and high R,are identified as contributing to the time dependent component of cracking. It is shown that these processes can enhance the crack growth per cycle significantly and reduce component lives.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Imperial College of Science, Technology and Medicine, London, UK

    G. A. Webster (Professor of Engineering Materials)

  2. Berkeley Technology Centre, Nuclear Electric plc, USA

    R. A. Ainsworth

Authors
  1. G. A. Webster
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  2. R. A. Ainsworth
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© 1994 Springer Science+Business Media Dordrecht

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Webster, G.A., Ainsworth, R.A. (1994). Creep—fatigue crack growth. In: High Temperature Component Life Assessment. Springer, Dordrecht. https://doi.org/10.1007/978-94-017-1771-7_6

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  • DOI: https://doi.org/10.1007/978-94-017-1771-7_6

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-90-481-4012-1

  • Online ISBN: 978-94-017-1771-7

  • eBook Packages: Springer Book Archive

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