Abstract
This paper presents a constitutive modeling of viscoplastic damage in 63Sn-37Pb solder material taking into account the effects of micro-structural change in grain coarsening. Based on the theory of damage mechanics, a two-scalar damage model is developed by introducing the damage variables and the free energy equivalence principle. An inelastic potential function based on the concept of inelastic damage energy release rate is proposed and used to derive an inelastic damage evolution equation.
The validation of the model is carried out for the viscoplastic material by predicting monotonic tensile behavior and tensile creep curves at different temperatures. The softening behavior of the material under monotonic tension loading can be characterized with the model. The results demonstrate adequately the validity of the proposed viscoplastic constitutive modeling for the solder material.
This work was supported by the United States Department of Energy under Contract DE-AC04-94AL85000. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy.
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© 2001 Springer Science+Business Media Dordrecht
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Wei, Y., Chow, C.L., Neilsen, M.K., Fang, H.E. (2001). Constitutive Modeling of Viscoplastic Damage in Solder Material. In: Murakami, S., Ohno, N. (eds) IUTAM Symposium on Creep in Structures. Solid Mechanics and its Applications, vol 86. Springer, Dordrecht. https://doi.org/10.1007/978-94-015-9628-2_14
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DOI: https://doi.org/10.1007/978-94-015-9628-2_14
Publisher Name: Springer, Dordrecht
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