Abstract
CMP aims at providing Universities, Research Laboratories and Industries with the facility to have their integrated circuit projects fabricated for prototyping and low volume production. Presently, users are provided with a number of processes: CMOS down to.18 µ, BiCMOS, SiGe HBT, GaAs HEMT and SOI/SOS. Micro Electro Mechanical Systems (MEMS) are provided in standard CMP runs in CMOS, BiCMOS and HEMT GaAs, using compatible front-side bulk micro-machining. MUMPS process is offered as a surface micro-machining. MCM processes, CAD software and design kits are also provided. This paper reviews the portfolio, addresses 2 main areas of development, namely deep submicron processes and MEMS, and discusses cooperation schemes.
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© 2000 Springer Science+Business Media Dordrecht
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Courtois, B., Torki, K., Charlot, B., Delori, H., Eyraud, S., Paillotin, J.F. (2000). Achievements and Advances at CMP. In: Courtois, B., Guillemot, N., Kamarinos, G., Stéhelin, G. (eds) Microelectronics Education. Springer, Dordrecht. https://doi.org/10.1007/978-94-015-9506-3_14
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DOI: https://doi.org/10.1007/978-94-015-9506-3_14
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