Design and Development of Miniature Electronics Systems

Abstract

To develop a packaging technique for miniaturized electronics using integrated and flat-pak circuit elements in cordwood packaging (Figure 12-1) methods, the designer should strive for reliability, weight reduction, volume reduction, and maintainability. The design should provide enough freedom to adapt to any application that may be specified, such as space vehicle, ground support equipment, vehicle installations such as truck or jeeps, and heavy industrial applications, -with compatible costs regardless of the final application. A standard module assembly should be a design goal. This standard module should be capable of installation into any existing standard installation, such as a standard 19-inch EIA (Electronics Industries Association) rack and panel, ATR (air transport racking) cases (Figure 12-2), or commercial instrument cases.