Abstract
The sole purpose of this process is to metallize the wall of drilled holes. This hole metallization provides an electrical connection between the sides of a panel, and to inner layers of multilayer boards. It is important that the plating supervisor train platers to understand this. Since metal in the hole is the requirement, the board must be processed at all times with this in mind.
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© 1985 Van Nostrand Reinhold Company Inc.
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Clark, R.H. (1985). The Electroless Copper Process. In: Handbook of Printed Circuit Manufacturing. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-7012-3_16
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DOI: https://doi.org/10.1007/978-94-011-7012-3_16
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-011-7014-7
Online ISBN: 978-94-011-7012-3
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